Huawei technologies co., ltd. (20240137686). HEADSET, HEADSET ASSEMBLY, AND RELATED METHOD simplified abstract
Contents
- 1 HEADSET, HEADSET ASSEMBLY, AND RELATED METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 HEADSET, HEADSET ASSEMBLY, AND RELATED METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
HEADSET, HEADSET ASSEMBLY, AND RELATED METHOD
Organization Name
Inventor(s)
Chengjie Shen of Shanghai (CN)
HEADSET, HEADSET ASSEMBLY, AND RELATED METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240137686 titled 'HEADSET, HEADSET ASSEMBLY, AND RELATED METHOD
Simplified Explanation
The patent application describes a headset with earbuds and earmuffs that can automatically adjust their shape to adapt to the wearer's environment, providing high wearing comfort.
- Earbuds with SMA component embedded in the earbud body
- Earmuffs with SMA component embedded in the earpad
- Automatic adjustment of shape to adapt to wearing environment
Potential Applications
This technology could be used in:
- Consumer headphones
- Communication headsets
- Virtual reality headsets
Problems Solved
- Uncomfortable headsets due to fixed shapes
- Poor fit leading to sound leakage
- Limited adaptability to different head sizes
Benefits
- Enhanced wearing comfort
- Improved sound quality
- Customized fit for each user
Potential Commercial Applications
"Adaptive Shape Headset Technology for Enhanced Comfort and Performance"
Possible Prior Art
There are no known prior art examples for this specific technology.
Unanswered Questions
How does the automatic adjustment of shape work?
The patent application does not provide detailed information on the mechanism behind the automatic adjustment of shape in the earbuds and earmuffs.
Are there any limitations to the adaptability of the headset?
The patent application does not mention any potential limitations or constraints that may affect the adaptability of the headset to different wearing environments.
Original Abstract Submitted
this application discloses a headset, where the headset includes an ear housing and an earbud fastened to the ear housing, the earbud includes an earbud body and an sma component embedded in the earbud body, and the earbud can automatically adjust a shape to adapt to a wearing environment. this application further discloses another headset, where the headset includes a headband and earmuffs connected to the headband, the earmuff includes an ear housing, an earpad fastened to the ear housing, and an sma component embedded in the earpad, and the earpad can automatically adjust a shape to adapt to a wearing environment. the headset has high wearing comfort. this application further discloses a headset assembly including the foregoing headset and a related method.
