HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS: abstract simplified (18155995)

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  • This abstract for appeared for patent application number 18155995 Titled 'HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS'

Simplified Explanation

The abstract describes a high frequency module that consists of a mounting substrate, a circuit component, a resin layer, and a shield layer. The mounting substrate has two main surfaces facing each other. The circuit component is mounted on one of the main surfaces. The resin layer is placed on the same main surface and covers part of the circuit component. The shield layer covers part of the resin layer and the main surface of the circuit component that is away from the mounting substrate. The module has a gap at various positions, including between the circuit component and the resin layer, between the circuit component and the shield layer, inside the resin layer, and inside the shield layer.


Original Abstract Submitted

The high frequency module includes a mounting substrate, a circuit component, a resin layer, and a shield layer. The mounting substrate has a first main surface and a second main surface that face each other. The circuit component is mounted on the first main surface of the mounting substrate. The resin layer is disposed on the first main surface of the mounting substrate and covers at least part of an outer peripheral surface of the circuit component. The shield layer covers at least part of the resin layer and a main surface of the circuit component that is far from the mounting substrate. The high frequency module has a gap at at least one of a position between the circuit component and the resin layer, a position between the circuit component and the shield layer, a position inside the resin layer, and a position inside the shield layer.

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