HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP patent applications published on March 21st, 2024

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Summary of the patent applications from HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP on March 21st, 2024

Hewlett Packard Enterprise Development LP has recently filed patents related to innovative technologies in the fields of electromagnetic interference (EMI) shielding, power distribution in printed circuit boards (PCBs), and anomaly detection in network performance metrics.

Summary: 1. EMI Shielding Technology: The patent describes an IC package with an electromagnetic shield made of a ferromagnetic material to prevent EMI noise in electronic devices. 2. Power Distribution in PCBs: The patent application details a multi-layer PCB design with plated through-hole vias for efficient power distribution to components. 3. Anomaly Detection in Network Performance: The patent application outlines systems and methods for reducing high-dimensional performance metrics to detect anomalous behavior in network functions.

Notable Applications:

  • EMI Shielding Technology: Smartphones, tablets, laptops, consumer electronics.
  • Power Distribution in PCBs: Smartphones, laptops, IoT devices.
  • Anomaly Detection in Network Performance: Telecommunications, cybersecurity, data centers.



Patent applications for HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP on March 21st, 2024

MACHINE LEARNING BASED FIRMWARE VERSION RECOMMENDER (17949106)

Main Inventor

SARGAM JAIN


OPTIMIZING OPERATION OF HIGH-PERFORMANCE COMPUTING SYSTEMS (17948159)

Main Inventor

Jan Maximilian Mäder


BACKUP RECOVERY FROM REMOTE STORAGE (17933579)

Main Inventor

Sijesh Thondapilly Balakrishnan


SCHEDULING JOBS ON GRAPHICAL PROCESSING UNITS (18307728)

Main Inventor

Diman Zad Tootaghaj


SINGLE-DOMAIN REGISTRATION INITIATED CANCELLATION (17945881)

Main Inventor

John I. Ayers


DETECTING AN ANOMALY EVENT IN LOW DIMENSIONAL SPACENETWORKS (18060753)

Main Inventor

Biswadeb DUTTA


POWER VIA RESONANCE SUPPRESSION (17949732)

Main Inventor

Melvin Kent Benedict


ELECTROMAGNETIC SHIELD OF AN INTEGRATED CIRCUIT PACKAGE (17932765)

Main Inventor

See Yun Yow