ELECTRONIC DEVICE COVER HAVING LAYERED STRUCTURE AND METHOD FOR MANUFACTURING SAME: abstract simplified (18209191)

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  • This abstract for appeared for patent application number 18209191 Titled 'ELECTRONIC DEVICE COVER HAVING LAYERED STRUCTURE AND METHOD FOR MANUFACTURING SAME'

Simplified Explanation

This application describes a cover for an electronic device that is made up of multiple layers. The cover includes a substrate made of magnesium, a layer that has undergone a chemical conversion treatment, a bending supplement layer, a color layer, and an ultraviolet molding layer. The abstract mentions that there are other possible embodiments of this device cover.


Original Abstract Submitted

This application relates to an electronic device cover having a layered structure and a method for manufacturing the same. An embodiment may include a substrate including magnesium, a first chemical conversion-treated layer formed on the substrate, a bending supplement layer formed on the first chemical conversion-treated layer, a color layer formed on the bending supplement layer, and an ultraviolet molding layer formed on the color layer. Various other embodiments are possible.

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