Delphi technologies ip limited (20240107718). SYSTEMS AND METHODS FOR AN INTERLOCKING FEATURE ON A POWER MODULE simplified abstract

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SYSTEMS AND METHODS FOR AN INTERLOCKING FEATURE ON A POWER MODULE

Organization Name

delphi technologies ip limited

Inventor(s)

Edward Choi of Lake Orion MI (US)

SYSTEMS AND METHODS FOR AN INTERLOCKING FEATURE ON A POWER MODULE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240107718 titled 'SYSTEMS AND METHODS FOR AN INTERLOCKING FEATURE ON A POWER MODULE

Simplified Explanation

The abstract of the patent application describes a system with a power module that has an interlocking feature on one surface, and at least one heat sink with a layer of thermal interface material on its surface.

  • The power module in the system includes an interlocking feature on one surface.
  • The heat sink in the system has a layer of thermal interface material on its surface.

Potential Applications

This technology could be applied in:

  • Electronic devices
  • Power systems
  • Automotive industry

Problems Solved

This technology helps in:

  • Improving heat dissipation
  • Enhancing power module stability

Benefits

The benefits of this technology include:

  • Better thermal management
  • Increased efficiency
  • Enhanced reliability

Potential Commercial Applications

This technology could be commercially applied in:

  • Manufacturing of electronic devices
  • Power generation industry
  • Automotive manufacturing

Possible Prior Art

One possible prior art for this technology could be:

  • Heat sink designs with thermal interface materials

Unanswered Questions

How does the interlocking feature on the power module surface enhance the overall system performance?

The interlocking feature on the power module surface helps in better alignment and stability of the components, but the specific impact on performance needs further clarification through testing and analysis.

What is the long-term durability of the thermal interface material on the heat sink surface?

The longevity and resilience of the thermal interface material over time, especially under varying temperature conditions, are important factors that need to be explored for a comprehensive understanding of the technology's reliability.


Original Abstract Submitted

a system includes a power module, wherein the power module includes an interlocking feature on a first surface of the power module; and at least one heat sink, wherein the surface of the at least one heat sink includes a layer of thermal interface material.

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