Delphi technologies ip limited (20240105534). SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE simplified abstract
Contents
- 1 SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE
Organization Name
delphi technologies ip limited
Inventor(s)
David Paul Buehler of Noblesville IN (US)
Kevin M. Gertiser of Carmel IN (US)
David W. Ihms of Kokomo IN (US)
Mark Wendell Gose of Kokomo IN (US)
SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105534 titled 'SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE
Simplified Explanation
The patent application describes a power module consisting of two substrates with semiconductor dies coupled to their inner surfaces, along with a flex circuit connected to the semiconductor die.
- The power module includes a first substrate with an inner surface where a semiconductor die is attached.
- A second substrate is present with a semiconductor die attached to its inner surface.
- A flex circuit is connected to the semiconductor die for enhanced functionality.
Potential Applications
The technology described in the patent application could be applied in:
- Power electronics
- Electric vehicles
- Renewable energy systems
Problems Solved
This technology helps in:
- Improving power module efficiency
- Enhancing thermal management
- Reducing overall size and weight of power modules
Benefits
The benefits of this technology include:
- Increased power density
- Improved reliability
- Enhanced performance
Potential Commercial Applications
The technology could find commercial applications in:
- Automotive industry
- Industrial automation
- Consumer electronics
Possible Prior Art
One possible prior art for this technology could be:
- Power modules with integrated cooling systems
Unanswered Questions
How does this technology compare to traditional power modules in terms of efficiency and performance?
This article does not provide a direct comparison between this technology and traditional power modules.
What are the potential challenges in implementing this technology on a larger scale for commercial applications?
This article does not address the challenges that may arise in scaling up this technology for commercial use.
Original Abstract Submitted
a power module includes: a first substrate having an outer surface and an inner surface; a semiconductor die coupled to the inner surface of the first substrate; a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate; and a flex circuit coupled to the semiconductor die.
