Delphi technologies ip limited (20240105533). SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE simplified abstract
Contents
- 1 SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE
Organization Name
delphi technologies ip limited
Inventor(s)
David Paul Buehler of Noblesville IN (US)
Kevin M. Gertiser of Carmel IN (US)
David W. Ihms of Kokomo IN (US)
Mark Wendell Gose of Kokomo IN (US)
SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105533 titled 'SYSTEMS AND METHODS FOR POWER MODULE FOR INVERTER FOR ELECTRIC VEHICLE
Simplified Explanation
The patent application describes a power module comprising a first substrate with a semiconductor die, a second substrate with a semiconductor die, and an electrically conductive spacer connecting the two substrates.
- The power module includes a first substrate with an inner surface where a semiconductor die is attached.
- A second substrate is also present with a semiconductor die attached to its inner surface.
- A first electrically conductive spacer connects the inner surfaces of the first and second substrates.
Potential Applications
This technology could be used in:
- Power electronics
- Electric vehicles
- Renewable energy systems
Problems Solved
This technology helps in:
- Improving power module efficiency
- Enhancing thermal management
- Increasing power density
Benefits
The benefits of this technology include:
- Higher performance
- Better reliability
- Improved thermal dissipation
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Automotive industry
- Industrial automation
- Power generation
Possible Prior Art
One possible prior art for this technology could be:
- Power modules with similar substrate configurations and semiconductor die arrangements.
Unanswered Questions
How does this technology compare to traditional power module designs?
This article does not provide a direct comparison between this technology and traditional power module designs.
What specific industries could benefit the most from this technology?
The article does not specify which industries could benefit the most from this technology.
Original Abstract Submitted
a power module includes: a first substrate having an outer surface and an inner surface; a semiconductor die coupled to the inner surface of the first substrate; a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate; and a first electrically conductive spacer coupled to inner surface of the first substrate and to the inner surface of the second substrate.
