Dell products l.p. (20240138123). SYSTEM AND METHOD FOR THERMAL MANAGEMENT USING LIQUID COOLING simplified abstract
Contents
- 1 SYSTEM AND METHOD FOR THERMAL MANAGEMENT USING LIQUID COOLING
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SYSTEM AND METHOD FOR THERMAL MANAGEMENT USING LIQUID COOLING - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology compare to traditional air cooling systems in terms of efficiency and performance?
- 1.11 What are the potential maintenance requirements for the liquid cooling system described in the patent application?
- 1.12 Original Abstract Submitted
SYSTEM AND METHOD FOR THERMAL MANAGEMENT USING LIQUID COOLING
Organization Name
Inventor(s)
Tyler Baxter Duncan of Austin TX (US)
Anthony Middleton of Cedar Park TX (US)
Ty Robert Schmitt of Round Rock TX (US)
SYSTEM AND METHOD FOR THERMAL MANAGEMENT USING LIQUID COOLING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240138123 titled 'SYSTEM AND METHOD FOR THERMAL MANAGEMENT USING LIQUID COOLING
Simplified Explanation
The patent application describes an information handling system with a liquid cooling system that includes two manifolds to regulate the flow of coolant within the chassis.
- The chassis of the information handling system has a chassis inlet and a chassis outlet for coolant flow.
- The first manifold in the liquid cooling system has a first chassis outlet that provides coolant flow to the chassis inlet, and a first chassis inlet that receives coolant flow from the chassis outlet.
- The second manifold in the liquid cooling system has a second chassis outlet that provides coolant flow to the chassis inlet, and a second chassis inlet that receives coolant flow from the chassis outlet.
Potential Applications
The technology described in this patent application could be applied in high-performance computing systems, data centers, and server farms where efficient cooling is essential to maintain optimal performance.
Problems Solved
This technology solves the problem of overheating in information handling systems by providing an effective liquid cooling system that can efficiently regulate the temperature within the chassis.
Benefits
The benefits of this technology include improved performance and reliability of information handling systems, reduced risk of overheating and hardware failure, and potentially longer lifespan of the equipment.
Potential Commercial Applications
The liquid cooling system described in this patent application could be commercially applied in the design and manufacturing of high-performance servers, supercomputers, and other data center equipment.
Possible Prior Art
One possible prior art for this technology could be the use of liquid cooling systems in high-performance computing systems and data centers to improve cooling efficiency and reduce the risk of overheating.
Unanswered Questions
How does this technology compare to traditional air cooling systems in terms of efficiency and performance?
The article does not provide a direct comparison between liquid cooling systems and traditional air cooling systems in terms of efficiency and performance.
What are the potential maintenance requirements for the liquid cooling system described in the patent application?
The article does not address the potential maintenance requirements for the liquid cooling system, such as frequency of coolant replacement or system cleaning.
Original Abstract Submitted
an information handling system includes a chassis that includes a chassis inlet and a chassis outlet and a liquid cooling system that includes a first manifold. the first manifold includes a first chassis outlet configured to provide a first inlet coolant flow to the chassis inlet and a first chassis inlet configured to receive a first outlet coolant flow from the chassis outlet. the liquid cooling system also includes a second manifold that includes a second chassis outlet configured to provide the first inlet coolant flow to the chassis inlet, and a second chassis inlet configured to receive the first outlet coolant flow from the chassis outlet.
