Dell products l.p. (20240138106). COOLING AND SHOCK ISOLATION ARCHITECTURE FOR STANDALONE AND SCALABLE LIQUID COOLING MODULES simplified abstract
Contents
- 1 COOLING AND SHOCK ISOLATION ARCHITECTURE FOR STANDALONE AND SCALABLE LIQUID COOLING MODULES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 COOLING AND SHOCK ISOLATION ARCHITECTURE FOR STANDALONE AND SCALABLE LIQUID COOLING MODULES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this system compare to other liquid cooling systems available in the market?
- 1.11 What are the specific shock isolation components used in the cooling lines?
- 1.12 Original Abstract Submitted
COOLING AND SHOCK ISOLATION ARCHITECTURE FOR STANDALONE AND SCALABLE LIQUID COOLING MODULES
Organization Name
Inventor(s)
Tyler Baxter Duncan of Austin TX (US)
Anthony Middleton of Cedar Park TX (US)
COOLING AND SHOCK ISOLATION ARCHITECTURE FOR STANDALONE AND SCALABLE LIQUID COOLING MODULES - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240138106 titled 'COOLING AND SHOCK ISOLATION ARCHITECTURE FOR STANDALONE AND SCALABLE LIQUID COOLING MODULES
Simplified Explanation
The patent application describes a system for providing liquid and air cooling for IT components, including dry coolers, liquid heat exchange devices, and cooling lines beneath a floor.
- The system includes a first module with dry coolers that supply liquid cooling to liquid heat exchange devices.
- A second module contains the liquid heat exchange devices that provide liquid cooling to IT units in a third module.
- The third module includes cooling lines beneath a floor, with removable floor panels and shock isolation components for the cooling lines.
Potential Applications
This technology could be used in data centers, server rooms, and other IT facilities to efficiently cool equipment and prevent overheating.
Problems Solved
This system solves the problem of overheating in IT components, which can lead to malfunctions, data loss, and reduced lifespan of equipment.
Benefits
The system provides effective cooling for IT components, improves performance and reliability, and allows for easy maintenance and access to cooling components.
Potential Commercial Applications
This technology could be applied in the design and construction of new data centers, server rooms, and IT facilities to enhance cooling efficiency and equipment performance.
Possible Prior Art
One possible prior art could be traditional cooling systems for IT components, such as air conditioning units and fans, which may not be as efficient or effective as the system described in the patent application.
Unanswered Questions
How does this system compare to other liquid cooling systems available in the market?
The article does not provide a direct comparison with other liquid cooling systems in terms of efficiency, cost, or performance.
What are the specific shock isolation components used in the cooling lines?
The patent application mentions shock isolation components for the cooling lines, but does not provide details on the specific components or how they function to prevent damage or disruptions in the cooling system.
Original Abstract Submitted
multiple systems for providing liquid and air cooling for it components is disclosed. the system includes a first module with at least one dry cooler that supplies liquid cooling to at least one liquid heat exchange device. the system includes a second module with the at least one liquid heat exchange device that provides liquid cooling to a third module comprising one or more it units. the third module includes one or more cooling lines in a space beneath a floor that provides liquid cooling to the one or more it units, with at least one removable floor panel, and one or more shock isolation components for the one or more cooling lines.
