Dell products l.p. (20240138089). TEMPEST SEAL FOR MODULAR DATA CENTERS simplified abstract

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TEMPEST SEAL FOR MODULAR DATA CENTERS

Organization Name

dell products l.p.

Inventor(s)

Tyler Baxter Duncan of Austin TX (US)

Anthony Middleton of Cedar Park TX (US)

Jeffery Todd Sayles of San Marcos TX (US)

TEMPEST SEAL FOR MODULAR DATA CENTERS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240138089 titled 'TEMPEST SEAL FOR MODULAR DATA CENTERS

Simplified Explanation

The abstract describes a modular data center comprising a modular information technology component (MITC) and a modular environmental control component (MECC) connected by a scaffold interface with an enclosure component affixed to the outside surfaces of both scaffolds.

  • The modular data center includes a modular information technology component (MITC) with a first scaffold.
  • The modular data center also includes a modular environmental control component (MECC) with a second scaffold.
  • The first scaffold is connected to the second scaffold to form a scaffold interface.
  • An enclosure component is affixed to the outside surface of the first scaffold and the second scaffold.
  • Once affixed, the enclosure component overlaps at least a portion of the scaffold interface.

Potential Applications

The modular data center can be used in various industries such as telecommunications, cloud computing, and data storage.

Problems Solved

This technology solves the problem of efficiently integrating information technology components with environmental control components in a modular data center.

Benefits

The modular data center allows for easy scalability, flexibility, and efficient cooling of IT equipment.

Potential Commercial Applications

"Modular Data Center Technology for Efficient IT Infrastructure Management"

Possible Prior Art

Prior art may include modular data center designs with separate components for IT and environmental control, but not specifically addressing the scaffold interface concept.

Unanswered Questions

How does the enclosure component affect the overall efficiency of the data center?

The article does not provide details on how the enclosure component contributes to the efficiency of the data center in terms of cooling or energy consumption.

Are there any specific industry standards or regulations that this technology must comply with?

The article does not mention any industry standards or regulations that the modular data center must adhere to, which could be crucial for its adoption in certain sectors.


Original Abstract Submitted

a modular data center includes: a modular information technology component (mitc), in which the mitc includes a first scaffold; and a modular environmental control component (mecc), in which the mecc includes a second scaffold, in which the first scaffold is connected to the second scaffold to form a scaffold interface, in which an enclosure component is affixed to an outside surface of the first scaffold and to an outside surface of the second scaffold, and in which, once affixed to the first scaffold and to the second scaffold, the enclosure component overlaps at least a portion of the scaffold interface.