Dell products l.p. (20240138085). MODULE-TO-MODULE MECHANICAL, ELECTRICAL, AND AIRFLOW CONNECTIONS IN MODULAR DATA CENTERS simplified abstract
Contents
- 1 MODULE-TO-MODULE MECHANICAL, ELECTRICAL, AND AIRFLOW CONNECTIONS IN MODULAR DATA CENTERS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MODULE-TO-MODULE MECHANICAL, ELECTRICAL, AND AIRFLOW CONNECTIONS IN MODULAR DATA CENTERS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
MODULE-TO-MODULE MECHANICAL, ELECTRICAL, AND AIRFLOW CONNECTIONS IN MODULAR DATA CENTERS
Organization Name
Inventor(s)
Tyler Baxter Duncan of Austin TX (US)
Anthony Middleton of Cedar Park TX (US)
Jeffery Todd Sayles of San Marcos TX (US)
MODULE-TO-MODULE MECHANICAL, ELECTRICAL, AND AIRFLOW CONNECTIONS IN MODULAR DATA CENTERS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240138085 titled 'MODULE-TO-MODULE MECHANICAL, ELECTRICAL, AND AIRFLOW CONNECTIONS IN MODULAR DATA CENTERS
Simplified Explanation
A modular data center patent application describes a system that includes a modular information technology component (MITC) and a modular environmental control component (MECC), connected through mechanical and electrical connection components.
- The modular data center includes a modular information technology component (MITC) with information handling systems (IHS) and a utility control component (UCC).
- The MITC has a first connection interface with mechanical and electrical connection components (MECCOMs).
- The modular data center also includes a modular environmental control component (MECC) with environmental control components (ECCs).
- The MECC has a second connection interface with a second set of MECCOMs that pair with the first set of MECCOMs to create the data center.
- The first connection interface is connected to the second connection interface, enclosing an equal area.
Potential Applications
The modular data center technology can be used in various industries such as telecommunications, cloud computing, and edge computing.
Problems Solved
This technology solves the problem of scalability and flexibility in data center infrastructure by allowing for modular expansion and customization.
Benefits
The modular data center offers cost-effective scalability, improved energy efficiency, and simplified maintenance and upgrades.
Potential Commercial Applications
Potential commercial applications include data centers for large enterprises, colocation facilities, and edge computing deployments.
Possible Prior Art
One possible prior art for modular data centers is the use of prefabricated data center modules that can be quickly deployed and easily expanded.
Unanswered Questions
=== How does the modular data center technology impact energy consumption compared to traditional data centers? The article does not provide specific data on energy consumption savings or efficiency improvements.
=== Are there any limitations to the scalability of the modular data center technology? The article does not mention any potential limitations or constraints on the scalability of the modular data center technology.
Original Abstract Submitted
a modular data center includes: a modular information technology component (mitc), in which the mitc includes a plurality of information handling systems (ihss), a utility control component (ucc), and a first connection interface, in which the first connection interface includes a first set of mechanical and electrical connection components (meccoms); and a modular environmental control component (mecc), in which the mecc includes a plurality of environmental control components (eccs) and a second connection interface, in which the second connection interface includes a second set of meccoms to be paired with the first set of meccoms to generate at least a portion of the modular data center, and in which the first connection interface is connected to the second connection interface, in which an area enclosed by the first connection interface is equal to an area enclosed by the second connection interface.
