DAISY-CHAIN SEAL RING STRUCTURE: abstract simplified (18335413)

• This abstract for appeared for patent application number 18335413 Titled 'DAISY-CHAIN SEAL RING STRUCTURE'

Simplified Explanation

This abstract describes a semiconductor device that consists of two wafers. The device includes a seal ring structure, which is made up of three metal structures located within the bodies of the two wafers. Additionally, there is a metal bonding structure that connects these metal structures through the interface between the two wafers. The first set of metal elements connects the first metal structure in the first wafer with the third metal structure in the second wafer, while the second set of metal elements connects the second metal structure in the first wafer with the third metal structure in the second wafer.

Original Abstract Submitted

A semiconductor device includes a first wafer and a second wafer. The semiconductor device includes a seal ring structure comprising a first metal structure in a body of the first wafer, a second metal structure in the body of the first wafer, a third metal structure in a body of the second wafer, and a metal bonding structure including a first set of metal elements coupling the first metal structure and the third metal structure through an interface between the first wafer and the second wafer, and a second set of metal elements coupling the second metal structure and the third metal structure through the interface between the first wafer and the second wafer.