Chemical Mechanical Planarization Tool: abstract simplified (18334526)

From WikiPatents
Jump to navigation Jump to search
  • This abstract for appeared for patent application number 18334526 Titled 'Chemical Mechanical Planarization Tool'

Simplified Explanation

The abstract describes a method for operating a chemical mechanical planarization (CMP) tool. In this method, a polishing pad is attached to a platen using glue. After removing the polishing pad, residue portions of the glue are left on the platen's surface. These residue portions are then identified using a fluorescent material, and subsequently removed from the platen's surface.


Original Abstract Submitted

A method of operating a chemical mechanical planarization (CMP) tool includes attaching a polishing pad to a first surface of a platen of the CMP tool using a glue; removing the polishing pad from the platen, wherein after removing the polishing pad, residue portions of the glue remain on the first surface of the platen; identifying locations of the residue portions of the glue on the first surface of the platen using a fluorescent material; and removing the residue portions of the glue from the first surface of the platen.

Retrieved from "http://wikipatents.org/index.php?title=Chemical_Mechanical_Planarization_Tool:_abstract_simplified_(18334526)&oldid=2074"