Canon kabushiki kaisha (20240134270). PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN ARTICLE simplified abstract
Contents
- 1 PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN ARTICLE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN ARTICLE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN ARTICLE
Organization Name
Inventor(s)
Seth J. Bamesberger of Austin TX (US)
Byung-Jin Choi of Austin TX (US)
Steven C. Shackleton of Austin TX (US)
Masaki Saito of Austin TX (US)
PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN ARTICLE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240134270 titled 'PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN ARTICLE
Simplified Explanation
The planarization system described in the abstract is a system that includes a superstrate chuck with an inflatable membrane and a purge gas channel for holding and planarizing a superstrate.
- Superstrate chuck with holding surface: The system includes a chuck with a holding surface designed to hold a superstrate in place during planarization.
- Inflatable membrane: The chuck features an inflatable membrane with an inner and outer diameter, as well as a midpoint between the two edges in a radial direction.
- Purge gas channel: There is a purge gas channel located radially inward of the midpoint of the inflatable membrane and radially outward of the holding surface of the chuck.
Potential Applications
This technology could be applied in the manufacturing of flat panel displays, semiconductor devices, and other electronic components that require precise planarization processes.
Problems Solved
This system helps to achieve uniform and smooth surfaces on superstrates, which is crucial for the performance and reliability of electronic devices.
Benefits
The planarization system offers improved accuracy, efficiency, and consistency in the planarization process, leading to higher quality electronic components.
Potential Commercial Applications
"Advanced Planarization System for Electronic Component Manufacturing"
Possible Prior Art
There may be prior art related to planarization systems using inflatable membranes and purge gas channels, but specific examples are not provided in the abstract.
Unanswered Questions
How does the inflatable membrane contribute to the planarization process?
The abstract mentions the inflatable membrane, but it does not explain how it specifically helps in achieving planarization of the superstrate.
What materials are typically used for the inflatable membrane and purge gas channel?
The abstract does not provide information on the materials commonly used for the inflatable membrane and purge gas channel in such planarization systems.
Original Abstract Submitted
a planarization system, comprising a superstrate chuck including a holding surface configured to hold a superstrate, an inflatable membrane having an inner diameter defining an inner edge, an outer diameter defining an outer edge, and, a midpoint between the inner edge and the outer edge in a radial direction, wherein the inflatable membrane is disposed radially outward of the holding surface of the superstrate chuck, and a purge gas channel disposed radially inward of the midpoint of the inflatable membrane and radially outward of the holding surface of the superstrate chuck.
