Canon kabushiki kaisha (20240131805). BONDING APPARATUS, BONDING METHOD AND ARTICLE MANUFACTURING METHOD simplified abstract
Contents
- 1 BONDING APPARATUS, BONDING METHOD AND ARTICLE MANUFACTURING METHOD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 BONDING APPARATUS, BONDING METHOD AND ARTICLE MANUFACTURING METHOD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
BONDING APPARATUS, BONDING METHOD AND ARTICLE MANUFACTURING METHOD
Organization Name
Inventor(s)
KENICHIRO Mori of Tochigi (JP)
BONDING APPARATUS, BONDING METHOD AND ARTICLE MANUFACTURING METHOD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240131805 titled 'BONDING APPARATUS, BONDING METHOD AND ARTICLE MANUFACTURING METHOD
Simplified Explanation
The bonding apparatus described in the abstract is a device designed to bond a second object to a first object by protruding the second object to the side of the first object via a sheet held by the holding unit. The apparatus includes a holding unit, a protrusion mechanism, a measurement unit, and a processing unit.
- Holding unit: Holds a sheet with the second object stuck thereto.
- Protrusion mechanism: Protrudes the second object to a side of the first object via the sheet held by the holding unit.
- Measurement unit: Measures the position of the second object stuck to the sheet with respect to the first object.
- Processing unit: Performs a process of positioning the first object and the second object based on the position measured by the measurement unit in a state where the second object is protruded to the side of the first object by the protrusion mechanism.
Potential Applications
The technology could be applied in industries such as manufacturing, electronics, and automotive for precise bonding of components.
Problems Solved
This technology solves the problem of accurately positioning and bonding two objects together, which can be challenging in various manufacturing processes.
Benefits
The benefits of this technology include improved accuracy in bonding objects, increased efficiency in manufacturing processes, and reduced errors in component assembly.
Potential Commercial Applications
- Precision manufacturing equipment
- Electronics assembly machinery
- Automotive production line tools
Possible Prior Art
One possible prior art could be robotic arms used in manufacturing processes for positioning and bonding components together.
Unanswered Questions
How does the apparatus handle different sizes and shapes of objects to be bonded together?
The abstract does not provide information on the flexibility of the apparatus in handling various sizes and shapes of objects.
What materials can be used for the sheet that holds the second object?
The abstract does not specify the types of materials that can be used for the sheet in the bonding process.
Original Abstract Submitted
a bonding apparatus for bonding a second object to a first object, including a holding unit configured to hold a sheet with the second object stuck thereto, a protrusion mechanism configured to protrude the second object to a side of the first object via the sheet held by the holding unit, a measurement unit configured to measure, with respect to the first object, a position of the second object stuck to the sheet held by the holding unit, and a processing unit configured to perform a process of positioning the first object and the second object based on the position measured by the measurement unit in a state in which the second object is protruded to the side of the first object by the protrusion mechanism.
