Canon kabushiki kaisha (20240123731). METHOD OF MANUFACTURING LIQUID DISCHARGING HEAD AND LIQUID DISCHARGING HEAD simplified abstract
Contents
- 1 METHOD OF MANUFACTURING LIQUID DISCHARGING HEAD AND LIQUID DISCHARGING HEAD
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHOD OF MANUFACTURING LIQUID DISCHARGING HEAD AND LIQUID DISCHARGING HEAD - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does this technology compare to existing methods of manufacturing liquid discharging heads?
- 1.11 What are the specific industries or sectors that could benefit the most from this technology?
- 1.12 Original Abstract Submitted
METHOD OF MANUFACTURING LIQUID DISCHARGING HEAD AND LIQUID DISCHARGING HEAD
Organization Name
Inventor(s)
JUNICHIRO Iri of Kanagawa (JP)
TAKANOBU Manabe of Kanagawa (JP)
METHOD OF MANUFACTURING LIQUID DISCHARGING HEAD AND LIQUID DISCHARGING HEAD - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240123731 titled 'METHOD OF MANUFACTURING LIQUID DISCHARGING HEAD AND LIQUID DISCHARGING HEAD
Simplified Explanation
The method of manufacturing a liquid discharging head involves preparing a wafer with an element and a discharge port formation member, forming a recessed portion in the rear surface of the wafer, attaching the wafer to a dicing tape, cutting the wafer to form an element board, and connecting an electric wiring board to the terminal of the element board. The element board includes a discharge port for liquid discharge and an element to supply energy to the discharge port. The recessed portion is located at the cutting lines, ensuring the terminal overlaps a smaller area of the recessed portion.
- Wafer prepared with element and discharge port formation member
- Recessed portion formed in the rear surface of the wafer
- Cutting the wafer to form an element board
- Connecting an electric wiring board to the terminal of the element board
- Element board includes a discharge port and an element for energy supply
- Recessed portion located at cutting lines to minimize overlap with terminal
Potential Applications
The technology can be applied in inkjet printers, medical devices, and industrial equipment that require precise liquid discharging capabilities.
Problems Solved
This technology solves the problem of efficiently manufacturing liquid discharging heads with precise control over the discharge process.
Benefits
The benefits of this technology include improved accuracy in liquid discharge, increased efficiency in manufacturing processes, and enhanced performance in various applications.
Potential Commercial Applications
The potential commercial applications of this technology include inkjet printer manufacturing, medical device production, and industrial equipment development.
Possible Prior Art
One possible prior art could be the traditional methods of manufacturing liquid discharging heads, which may not have the same level of precision and efficiency as the method described in this patent application.
Unanswered Questions
How does this technology compare to existing methods of manufacturing liquid discharging heads?
The article does not provide a direct comparison to existing methods, leaving the reader to wonder about the specific advantages and differences between this technology and traditional manufacturing processes.
What are the specific industries or sectors that could benefit the most from this technology?
The article mentions potential applications in inkjet printers, medical devices, and industrial equipment, but does not delve into the specific advantages or market potential within each industry.
Original Abstract Submitted
a method of manufacturing a liquid discharging head includes preparing a wafer provided with an element and a discharge port formation member on a front surface of the wafer, forming a recessed portion in a rear surface of the wafer, attaching the rear surface of the wafer and a dicing tape, cutting the wafer along cutting lines to form an element board, and connecting an electric wiring board and a terminal of the element board. the element board includes a discharge port formation member having a discharge port for discharging liquid and includes the element to supply energy to the discharge port for liquid discharge. the recessed portion is formed at a location corresponding to the cutting lines, and an area of a region where the terminal overlaps the recessed portion is smaller than an area of a region where the terminal does not overlap the recessed portion.
