Canon kabushiki kaisha (20240107670). ELECTRONIC COMPONENT, DISPLAY APPARATUS, AND IMAGING APPARATUS simplified abstract

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ELECTRONIC COMPONENT, DISPLAY APPARATUS, AND IMAGING APPARATUS

Organization Name

canon kabushiki kaisha

Inventor(s)

JUN Tsukano of Tokyo (JP)

ELECTRONIC COMPONENT, DISPLAY APPARATUS, AND IMAGING APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240107670 titled 'ELECTRONIC COMPONENT, DISPLAY APPARATUS, AND IMAGING APPARATUS

Simplified Explanation

The electronic component described in the abstract includes first and second electrodes, first and second substrates with principal surfaces, and a connection member to connect the electrodes. The connection member is taller than the electrodes, and an intermediary body is placed between the second electrode and the connection member.

  • The electronic component consists of first and second electrodes, first and second substrates, and a connection member.
  • The connection member is taller than the electrodes, and an intermediary body is placed between the second electrode and the connection member.

Potential Applications

The technology described in this patent application could be used in various electronic devices such as sensors, actuators, and transducers.

Problems Solved

This technology solves the problem of efficiently connecting electrodes on different substrates with a connection member that is taller than the electrodes.

Benefits

The benefits of this technology include improved reliability and performance of electronic components due to the unique arrangement of electrodes and connection member.

Potential Commercial Applications

The potential commercial applications of this technology could include the manufacturing of advanced sensors, actuators, and other electronic devices for various industries.

Possible Prior Art

One possible prior art for this technology could be the use of intermediary bodies in electronic components to improve connections between electrodes and substrates.

Unanswered Questions

== How does this technology compare to existing methods of connecting electrodes on different substrates? This article does not provide a direct comparison to existing methods of connecting electrodes on different substrates. It would be helpful to know the advantages and disadvantages of this technology compared to traditional methods.

== What are the specific industries that could benefit the most from this technology? The article does not specify the specific industries that could benefit the most from this technology. It would be interesting to explore potential applications in industries such as automotive, aerospace, and consumer electronics.


Original Abstract Submitted

an electronic component includes first and second electrodes, first and second substrates having first and second principal surfaces, respectively, and a connection member to connect the first and second electrodes, wherein the first and second electrodes are arranged on the first and second principal surfaces, respectively, a height of the connection member is greater than those of the first and second electrodes in the direction perpendicular to the first principal surface, a distance between a portion of the first principal surface not in contact with the first electrode and a portion of the second principal surface not in contact with the second electrode is shorter than a distance between a portion of the first principal surface in contact with the first electrode and a portion of the second principal surface in contact with the second electrode, and an intermediary body is arranged between the second electrode and the connection member.