CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME: abstract simplified (18145949)

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  • This abstract for appeared for patent application number 18145949 Titled 'CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME'

Simplified Explanation

The abstract describes a circuit module that consists of two circuit components. The first component has electrode pads on one side, while the second component has electrode pads on the other side. These electrode pads are joined together using a conductive bonding material. Additionally, a first reinforcing bonding material is used to connect the first surface of the first circuit component to the second surface of the second circuit component. A second reinforcing bonding material is also present, which is in contact with the first reinforcing bonding material and joins the two surfaces of the circuit components together.


Original Abstract Submitted

A circuit module includes: a first circuit component having electrode pads on a first surface; and a second circuit component having electrode pads on a second surface. A conductive bonding material joins the electrode pads of the first circuit component to the electrode pads of the second circuit component respectively. A first reinforcing bonding material is not in contact with the conductive bonding material and joins the first surface of the first circuit component to the second surface of the second circuit component. A second reinforcing bonding material is located in contact with the first reinforcing bonding material, and joins the first surface of the first circuit component to the second surface of the second circuit component.

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