CHIP-ON-FILM SEMICONDUCTOR PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME: abstract simplified (18092241)

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  • This abstract for appeared for patent application number 18092241 Titled 'CHIP-ON-FILM SEMICONDUCTOR PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME'

Simplified Explanation

The abstract describes a semiconductor package called chip-on-film (COF) that consists of a main film substrate and at least two sub-modules. The main film substrate has two module attachment regions where the sub-modules are attached. Each sub-module includes a sub-film substrate and a semiconductor chip mounted on it. The main film substrate and the sub-film substrate are connected by connection conductive layers, which allow electrical connection between the main film substrate and the sub-modules.


Original Abstract Submitted

A chip-on-film (COF) semiconductor package includes: a main film substrate having at least two module attachment regions spaced apart from each other; at least two sub-modules respectively attached to the at least two module attachment regions and spaced apart from each other on the main film substrate, wherein each of the at least two sub-modules comprise a sub-film substrate and a semiconductor chip mounted on the sub-film substrate; and at least two connection conductive layers provided between the main film substrate and the sub-film substrate, which is included in each of the at least two sub-modules, and electrically connecting the main film substrate to the at least two sub-modules.

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