CHANGXIN MEMORY TECHNOLOGIES, INC. patent applications published on March 21st, 2024
Summary of the patent applications from CHANGXIN MEMORY TECHNOLOGIES, INC. on March 21st, 2024
Recently, CHANGXIN MEMORY TECHNOLOGIES, INC. has filed patents for innovative semiconductor structures aimed at improving memory storage devices. These patents describe methods for forming grooves in substrates to create semiconductor structures with enhanced performance and efficiency. The structures include memory arrays with storage cells, word line structures, and common bit lines, as well as transistors with optimized current flow between source and drain structures. These technologies offer benefits such as increased memory density, faster data access, and improved overall functionality of electronic devices.
Notable applications of these patents include:
- Solid-state drives
- Flash memory devices
- Embedded systems
- Amplifiers
- Switches
- Memory storage
These technologies have the potential to revolutionize the semiconductor industry by enabling the production of more advanced memory modules for various applications in consumer electronics, data centers, and the automotive industry.
Contents
- 1 Patent applications for CHANGXIN MEMORY TECHNOLOGIES, INC. on March 21st, 2024
- 1.1 DATA SAMPLING CIRCUIT, DELAY DETECTION CIRCUIT AND MEMORY (18527249)
- 1.2 MEMORY AND OPERATING METHOD THEREFOR (18157059)
- 1.3 MEMORY AND METHOD FOR OPERATING THE SAME (18169167)
- 1.4 SINGLE-LOOP MEMORY DEVICE, DOUBLE-LOOP MEMORY DEVICE, AND ZQ CALIBRATION METHOD (18524136)
- 1.5 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND MEMORY (18451077)
- 1.6 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME (18166492)
- 1.7 SEMICONDUCTOR STRUCTURE, PREPARATION METHOD THEREFOR AND MEMORY (18168899)
- 1.8 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (18366814)
- 1.9 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME (18510864)
- 1.10 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME (18525467)
- 1.11 DATA RECEIVING CIRCUIT, DATA RECEIVING SYSTEM, AND STORAGE APPARATUS (18232489)
- 1.12 Semiconductor Structure and Method Making the Same (18163072)
- 1.13 TRANSISTOR, SEMICONDUCTOR STRUCTURE, MEMORY, AND METHOD FOR FORMING SAME (18168542)
- 1.14 SEMICONDUCTOR STRUCTURE AND FORMING METHOD AND OPERATING METHOD THEREFOR (18511808)
- 1.15 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME (18450509)
Patent applications for CHANGXIN MEMORY TECHNOLOGIES, INC. on March 21st, 2024
DATA SAMPLING CIRCUIT, DELAY DETECTION CIRCUIT AND MEMORY (18527249)
Main Inventor
Zhiqiang ZHANG
MEMORY AND OPERATING METHOD THEREFOR (18157059)
Main Inventor
Kangling JI
MEMORY AND METHOD FOR OPERATING THE SAME (18169167)
Main Inventor
Kangling JI
SINGLE-LOOP MEMORY DEVICE, DOUBLE-LOOP MEMORY DEVICE, AND ZQ CALIBRATION METHOD (18524136)
Main Inventor
Kai TIAN
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND MEMORY (18451077)
Main Inventor
Shuhao ZHANG
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME (18166492)
Main Inventor
Mingming MA
SEMICONDUCTOR STRUCTURE, PREPARATION METHOD THEREFOR AND MEMORY (18168899)
Main Inventor
Zengyan FAN
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF (18366814)
Main Inventor
Yuan FANG
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME (18510864)
Main Inventor
Yuan FANG
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME (18525467)
Main Inventor
Yuan FANG
DATA RECEIVING CIRCUIT, DATA RECEIVING SYSTEM, AND STORAGE APPARATUS (18232489)
Main Inventor
Feng LIN
Semiconductor Structure and Method Making the Same (18163072)
Main Inventor
Qinghua HAN
TRANSISTOR, SEMICONDUCTOR STRUCTURE, MEMORY, AND METHOD FOR FORMING SAME (18168542)
Main Inventor
Yi TANG
SEMICONDUCTOR STRUCTURE AND FORMING METHOD AND OPERATING METHOD THEREFOR (18511808)
Main Inventor
Takao Adachi
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME (18450509)
Main Inventor
Qinghua HAN
