BOARD: abstract simplified (18157994)

• This abstract for appeared for patent application number 18157994 Titled 'BOARD'

Simplified Explanation

This abstract describes a new type of board that has a strong bond between an insulating layer and a metal layer. The board consists of an insulating layer made of resin and an insulating filler, with a metal layer on top. The resin is found partially between the insulating filler and the metal layer. At the interface between the insulating layer and the metal layer, the depth of the metal in the insulating layer is no more than 1.2 µm based on the resin or insulating filler on the outermost surface of the insulating layer.

Original Abstract Submitted

Provided is a new board with a sufficient adhesion strength between an insulating layer and a metal layer. A board of the embodiment is a board including an insulating layer and a metal layer. The insulating layer contains a resin containing an insulating filler. The metal layer is disposed on a surface of the insulating layer. The resin is present partially between at least a part of the insulating filler present in the surface of the insulating layer and a metal constituting the metal layer. In an interface between the insulating layer and the metal layer, a depth of the metal present at a deepest portion in the insulating layer is 1.2 µm or less based on the resin or the insulating filler present in an outermost surface of the insulating layer.