Applied Materials, Inc. patent applications published on November 30th, 2023

Summary of the patent applications from Applied Materials, Inc. on November 30th, 2023

Applied Materials, Inc. has recently filed several patents related to various aspects of semiconductor device processing and manufacturing. These patents cover topics such as spin-orbit torque magnetoresistive random-access memory (SOT-MRAM) devices, OLED device processing, chemical mechanical polishing assemblies, substrate backside damage reduction, metal oxo photoresist deposition, selective metal removal, semiconductor processing using oxygen-containing and halide precursors, flowable silicon film for gap filling, cleaning bevel areas of substrate supports, and flow guides for semiconductor manufacturing.

Summary: - Applied Materials, Inc. has filed patents for spin-orbit torque magnetoresistive random-access memory (SOT-MRAM) devices and their manufacturing methods. - They have also filed patents for methods of processing OLED devices, including the formation of anode layers using metal oxide materials and protective barriers. - Patents have been filed for chemical mechanical polishing assemblies, including fluid delivery conduits with conductive wires for electrostatic discharge. - Applied Materials, Inc. has filed patents for reducing substrate backside damage during semiconductor device processing, including plasma preheat treatments and improved substrate support designs. - They have also filed patents for depositing metal oxo photoresist films using dry deposition processes, eliminating the need for wet chemical processes. - Patents have been filed for selectively removing metal material from feature surfaces and sidewalls, as well as for semiconductor processing using oxygen-containing and halide precursors. - Applied Materials, Inc. has filed patents for filling gaps within substrate features using flowable silicon films, cleaning bevel areas of substrate supports, and flow guides for deposition process adjustability in semiconductor manufacturing.

Notable Applications:

• SOT-MRAM devices and manufacturing methods.
• OLED device processing methods.
• Chemical mechanical polishing assemblies with electrostatic discharge capabilities.
• Substrate backside damage reduction during semiconductor processing.
• Metal oxo photoresist deposition using dry processes.
• Selective metal removal from feature surfaces and sidewalls.
• Semiconductor processing using oxygen-containing and halide precursors.
• Flowable silicon film for gap filling in substrate features.
• Cleaning bevel areas of substrate supports in plasma processing chambers.
• Flow guides for deposition process adjustability in semiconductor manufacturing.