Apple inc. (20240107249). MOLDED INTEGRATED CIRCUIT PACKAGE WITH SENSOR ASSEMBLY simplified abstract
Contents
- 1 MOLDED INTEGRATED CIRCUIT PACKAGE WITH SENSOR ASSEMBLY
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MOLDED INTEGRATED CIRCUIT PACKAGE WITH SENSOR ASSEMBLY - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
MOLDED INTEGRATED CIRCUIT PACKAGE WITH SENSOR ASSEMBLY
Organization Name
Inventor(s)
Ali N. Ergun of Sunnyvale CA (US)
Anthony D. Minervini of Gilroy CA (US)
Bilal Mohamed Ibrahim Kani of Singapore (SG)
Kishore N. Renjan of Singapore (SG)
MOLDED INTEGRATED CIRCUIT PACKAGE WITH SENSOR ASSEMBLY - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240107249 titled 'MOLDED INTEGRATED CIRCUIT PACKAGE WITH SENSOR ASSEMBLY
Simplified Explanation
The patent application describes a structure with a substrate, an electronic device, and a molding compound layer. The substrate has a first surface and a second surface, with a first opening. The electronic device is on the first surface of the substrate and has a second opening aligned with the first opening of the substrate. The molding compound layer is on the second surface of the substrate and has a third opening aligned with the second opening of the electronic device.
- Structure with substrate, electronic device, and molding compound layer
- Substrate with first and second surfaces, and a first opening
- Electronic device on first surface with second opening aligned with substrate opening
- Molding compound layer on second surface with third opening aligned with electronic device opening
Potential Applications
This technology could be used in:
- Semiconductor manufacturing
- Electronics packaging
Problems Solved
This technology helps with:
- Protecting electronic components
- Ensuring proper alignment
Benefits
The benefits of this technology include:
- Improved durability
- Enhanced performance
Potential Commercial Applications
This technology could be applied in:
- Consumer electronics
- Automotive industry
Possible Prior Art
One possible prior art for this technology could be:
- Existing electronic packaging methods
Unanswered Questions
How does this technology impact manufacturing costs?
The patent application does not provide information on the cost implications of implementing this technology.
What materials are used in the molding compound layer?
The patent application does not specify the materials used in the molding compound layer.
Original Abstract Submitted
embodiments of the present disclosure include a structure with a substrate, an electronic device, and a molding compound layer. the substrate has a first surface and a second surface opposite to the first surface, where the substrate includes a first opening. the electronic device is disposed on the first surface of the substrate and includes a second opening aligned with the first opening of the substrate. further, the molding compound layer is disposed on the second surface of the substrate and includes a third opening aligned with the second opening of the electronic device.
