Apple inc. (20240105709). Stacked FET Standard Cell Architecture simplified abstract
Contents
- 1 Stacked FET Standard Cell Architecture
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Stacked FET Standard Cell Architecture - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
Stacked FET Standard Cell Architecture
Organization Name
Inventor(s)
Saurabh P. Sinha of Austin TX (US)
Emre Alptekin of San Jose CA (US)
Stacked FET Standard Cell Architecture - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240105709 titled 'Stacked FET Standard Cell Architecture
Simplified Explanation
The patent application discloses a cell layout that implements stacked transistors using both topside metal routing and backside metal routing. This layout allows for various connection routes between components of the transistors to be made based on desired device construction.
- Stacked transistors cell layout utilizing both topside and backside metal routing.
- Various connection routes between components of transistors can be established.
- Enables construction of various devices based on a basic cell structure.
Potential Applications
The technology can be applied in the semiconductor industry for the manufacturing of advanced integrated circuits and electronic devices.
Problems Solved
1. Efficient routing of connections between components of stacked transistors. 2. Flexibility in designing and constructing different devices based on a basic cell structure.
Benefits
1. Improved performance and functionality of integrated circuits. 2. Enhanced flexibility and customization in device construction. 3. Potential for increased efficiency in manufacturing processes.
Potential Commercial Applications
Optimizing semiconductor manufacturing processes for improved device performance and functionality.
Possible Prior Art
Prior art related to the use of stacked transistors in cell layouts for integrated circuits and electronic devices.
Unanswered Questions
== How does this technology impact the overall cost of manufacturing integrated circuits? The patent application does not provide specific details on the cost implications of implementing this cell layout. Further research or analysis may be needed to determine the cost-effectiveness of this technology.
== What are the potential challenges in scaling this technology for mass production? The scalability of this technology for mass production is not addressed in the patent application. Additional studies or experiments may be required to assess the challenges and feasibility of scaling up this innovation for commercial manufacturing purposes.
Original Abstract Submitted
a cell layout that implements stacked transistors is disclosed. the cell layout utilizes both topside metal routing and backside metal routing. various connection routes between components of the transistors (e.g., gates, sources, and drains) and either the topside metal routing or the backside metal routing can be made. the specific connection routes can be determined based on a desired device construction. thus, the cell layout disclosed enables various devices to be constructed based on a basic cell structure.
