Apple inc. (20240105525). Test Architecture for High Throughput Testing of Pixel Driver Chips for Display Application simplified abstract

Test Architecture for High Throughput Testing of Pixel Driver Chips for Display Application

Organization Name

apple inc.

Inventor(s)

Imran Hashim of Saratoga CA (US)

Xiang Lu of Campbell CA (US)

Stanley B. Wang of Cupertino CA (US)

Xuchun Liu of Foster City CA (US)

Mahdi Farrokh Baroughi of Santa Clara CA (US)

Yongjie Jiang of Santa Clara CA (US)

Hopil Bae of Sunnyvale CA (US)

Hasan Akyol of Mountain View CA (US)

Baris Posat of Saratoga CA (US)

John T. Wetherell of San Jose CA (US)

Lei Wu of San Jose CA (US)

Test Architecture for High Throughput Testing of Pixel Driver Chips for Display Application - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240105525 titled 'Test Architecture for High Throughput Testing of Pixel Driver Chips for Display Application

Simplified Explanation

The abstract of the patent application describes methods of testing pixel driver chip donor wafers, including forming a redistribution layer over the wafer, probing to determine known good dies, and removing the redistribution layer. Test routing is also formed in the pixel driver chip using a polycide material or doped region in the semiconductor wafer.

• Formation of redistribution layer over pixel driver chip donor wafer
• Probing to determine known good dies
• Removal of redistribution layer
• Test routing in pixel driver chip using polycide material or doped region

Potential Applications

This technology could be applied in the semiconductor industry for testing and quality control of pixel driver chip donor wafers.

Problems Solved

This technology helps in identifying known good dies in pixel driver chip donor wafers, ensuring only functional chips are used in production.

Benefits

The benefits of this technology include improved yield rates in semiconductor manufacturing, reduced waste of defective chips, and overall cost savings.

Potential Commercial Applications

A potential commercial application of this technology could be in semiconductor fabrication facilities looking to enhance their quality control processes.

Possible Prior Art

Prior art in the field of semiconductor testing and quality control may include methods for testing and identifying defects in semiconductor wafers using various techniques such as probing and imaging.

Unanswered Questions

How does this technology compare to existing methods of testing pixel driver chip donor wafers?

This article does not provide a direct comparison to existing methods of testing pixel driver chip donor wafers. It would be beneficial to understand the advantages and limitations of this new approach in comparison to traditional testing methods.

What are the specific parameters used in the testing process to determine known good dies?

The article does not delve into the specific parameters or criteria used during the testing process to identify known good dies. Understanding the thresholds and criteria for determining the functionality of dies would provide valuable insights into the effectiveness of this testing method.

Original Abstract Submitted

test structures and methods of testing pixel driver chip donor wafers are described. in an embodiment, a redistribution layer is formed over a pixel driver chip donor wafer and probed to determine known good dies, followed by removal of the rdl. in other embodiments, test routing is formed in the pixel driver chip using a polycide material or doped region in the semiconductor wafer.