Apple inc. (20240098379). Image sensor with stacked pixels including charge sharing gates simplified abstract

Image sensor with stacked pixels including charge sharing gates

Organization Name

apple inc.

Inventor(s)

Vladimir Koifman of Rishon LeZion (IL)

Image sensor with stacked pixels including charge sharing gates - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240098379 titled 'Image sensor with stacked pixels including charge sharing gates

Simplified Explanation

The patent application describes an image sensor with a sensor die overlaid on a logic die, including detector elements with sensing circuits and pixel circuits for readout.

• The image sensor includes an array of detector elements with sensing circuits on the sensor die.
• Each detector element includes a photodiode, a floating diffusion node, a charge sharing transistor, a reset transistor, and a source follower transistor.
• A pixel circuit on the logic die includes a select transistor connected to the output of the source follower and one of the bitlines.
• Two current memory circuits are coupled to the select transistor to sense and output signals indicative of noise levels in the detector element.

1. 1. 1. Potential Applications

- Surveillance cameras - Medical imaging devices - Automotive cameras

1. 1. 1. Problems Solved

- Improved image quality by reducing noise levels - Enhanced performance of image sensors in low-light conditions

1. 1. 1. Benefits

- Higher quality images - Better performance in challenging lighting conditions - Increased sensitivity and accuracy

1. 1. 1. Potential Commercial Applications
         1. Enhanced Image Sensors for Various Industries

- Medical imaging companies - Security and surveillance technology providers - Automotive manufacturers

1. 1. 1. Possible Prior Art

There may be prior art related to image sensors with integrated noise reduction circuits or pixel readout technologies.

1. 1. 1. 1. Unanswered Questions
         2. How does the integration of the sensor die and logic die improve overall image sensor performance?

The integration of the sensor die and logic die allows for more efficient communication between the detector elements and readout circuits, potentially leading to faster and more accurate image capture.

1. 1. 1. 1. What specific types of noise are the current memory circuits designed to sense and mitigate?

The current memory circuits are designed to sense and output signals indicative of various types of noise, such as dark current noise, shot noise, and read noise, to optimize image quality.

Original Abstract Submitted

an image sensor includes a logic die, including column readout circuits and bitlines connected to the column readout circuits. a sensor die is overlaid on the logic die. the image sensor includes an array of detector elements, each including a sensing circuit on the sensor die, which includes a photodiode, a floating diffusion node a charge sharing transistor coupled between the photodiode and the floating diffusion node, a reset transistor coupled to the floating diffusion node, and a source follower transistor. in each detector element, a pixel circuit on the logic die includes a select transistor, which has an input coupled to the output of the source follower and an output coupled to one of the bitlines. two current memory circuits are coupled to the input of the select transistor and are configured to sense and output respective signals indicative of levels of noise in the detector element.