Apple inc. (20240098168). ELECTRONIC DEVICE INCLUDING A COMPOSITE ENCLOSURE COMPONENT HAVING METAL NANOPARTICLES simplified abstract

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ELECTRONIC DEVICE INCLUDING A COMPOSITE ENCLOSURE COMPONENT HAVING METAL NANOPARTICLES

Organization Name

apple inc.

Inventor(s)

Que Anh S. Nguyen of San Jose CA (US)

Weidi Zhu of Milpitas CA (US)

Nisha S. Sheth of San Mateo CA (US)

Andi M. Limarga of Cupertino CA (US)

ELECTRONIC DEVICE INCLUDING A COMPOSITE ENCLOSURE COMPONENT HAVING METAL NANOPARTICLES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240098168 titled 'ELECTRONIC DEVICE INCLUDING A COMPOSITE ENCLOSURE COMPONENT HAVING METAL NANOPARTICLES

Simplified Explanation

The abstract describes a composite enclosure component for an electronic device that includes metallic nanoparticles, non-metallic nanoparticles, or a combination of both, providing a hue, enhanced mechanical properties, or both.

  • The composite enclosure component for an electronic device includes metallic nanoparticles, non-metallic nanoparticles, or a combination of both.
  • The nanoparticles in the composite enclosure component may provide a specific hue to the device.
  • The nanoparticles may also enhance the mechanical properties of the enclosure component.

Potential Applications

The technology could be applied in various electronic devices such as smartphones, laptops, tablets, and other consumer electronics.

Problems Solved

1. Enhanced aesthetics and design options for electronic devices. 2. Improved mechanical strength and durability of the enclosure component.

Benefits

1. Customizable colors and finishes for electronic devices. 2. Increased protection and longevity of the device due to enhanced mechanical properties.

Potential Commercial Applications

Optimizing the composite enclosure component technology for smartphones to create a new line of visually appealing and durable devices.

Possible Prior Art

There may be existing patents or technologies related to composite materials used in electronic device enclosures, but specific prior art would need to be researched.

Unanswered Questions

How does the addition of metallic nanoparticles affect the overall weight of the composite enclosure component?

The abstract does not provide information on whether the addition of metallic nanoparticles increases or decreases the weight of the enclosure component.

Are there any potential environmental impacts associated with the use of metallic and non-metallic nanoparticles in electronic device enclosures?

The abstract does not address any environmental considerations or potential impacts of using nanoparticles in the composite enclosure component.


Original Abstract Submitted

a composite enclosure component for an electronic device is disclosed. the composite enclosure component may include metallic nanoparticles, non-metallic nanoparticles, or a combination of these. the nanoparticles of the composite enclosure component may provide a hue, enhanced mechanical properties, or both.