Apple inc. (20240094153). Enclosure Detection for Reliable Optical Failsafe simplified abstract
Contents
- 1 Enclosure Detection for Reliable Optical Failsafe
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Enclosure Detection for Reliable Optical Failsafe - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does the circuitry detect a rise in resistance in the sensing path?
- 1.11 What materials are used in the construction of the sensing path segments?
- 1.12 Original Abstract Submitted
Enclosure Detection for Reliable Optical Failsafe
Organization Name
Inventor(s)
Michael K. Mccord of San Francisco CA (US)
Stacy H. Mo of San Francisco CA (US)
Enclosure Detection for Reliable Optical Failsafe - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240094153 titled 'Enclosure Detection for Reliable Optical Failsafe
Simplified Explanation
The optical component integrity monitoring circuitry described in the patent application monitors the integrity of an optical component by detecting a rise in resistance in the sensing path and preventing the component from emitting light if damage is detected. The sensing path includes a first path for detecting damage to the optical element and a second path coupled to a package covering the optical element and light-emitting device. The first path includes segments formed from a metal trace on the optical element and a wire bond, providing mechanical compliance to tolerate expected strains. The second path ensures the package constrains movement of the optical element and its wires within a safe envelope defined by the package interior.
- Optical component integrity monitoring circuitry
- Monitors sensing path resistance
- Prevents light emission if damage detected
- First path for detecting damage to optical element
- Second path coupled to package covering optical element
- Segments formed from metal trace and wire bond
- Provides mechanical compliance and safe envelope for movement
Potential Applications
The technology can be applied in various industries such as telecommunications, medical devices, automotive, and aerospace for monitoring the integrity of optical components in critical systems.
Problems Solved
1. Ensures early detection of damage to optical components 2. Prevents malfunction or failure of optical devices due to damage
Benefits
1. Increases reliability and lifespan of optical components 2. Reduces maintenance costs by preventing catastrophic failures
Potential Commercial Applications
Optical communication systems, medical imaging devices, automotive safety systems, aerospace equipment
Possible Prior Art
There may be prior art related to monitoring the integrity of optical components in various industries, but specific examples are not provided in the patent application.
Unanswered Questions
How does the circuitry detect a rise in resistance in the sensing path?
The patent application does not provide detailed information on the specific mechanism or technology used to detect changes in resistance in the sensing path.
What materials are used in the construction of the sensing path segments?
The patent application mentions using a metal trace on the optical element and a wire bond for the segments, but it does not specify the exact materials or compositions used.
Original Abstract Submitted
optical component integrity monitoring circuitry monitors an optical component integrity sensing path in an optical component. if a rise in resistance of the sensing path is detected, the circuitry prevents the optical component from emitting light. the optical component may have a light-emitting device that emits light through an optical element. the sensing path may have a first path that is used to detect damage to the optical element and a second path that is coupled to a package covering the optical element and light-emitting device. the first path may have a segment formed from a metal trace on the optical element and a segment formed from a wire bond, providing mechanical compliance to tolerate strains expected in the use case. the second path ensures that the package is present to constrain movement of the optical element and its wires within a safe envelope defined by the package interior.