Apple inc. (20240105704). 3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding simplified abstract

3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding

Organization Name

apple inc.

Inventor(s)

Chonghua Zhong of Cupertino CA (US)

Jiongxin Lu of Cupertino CA (US)

Kunzhong Hu of Cupertino CA (US)

Jun Zhai of Cupertino CA (US)

Sanjay Dabral of Cupertino CA (US)

3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240105704 titled '3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-on-Reconstituted Wafer Bonding

Simplified Explanation

The abstract describes semiconductor packages formed using wafer reconstitution, potentially including an integrated heat spreader, and methods of fabrication. In one embodiment, the package includes multiple package levels with chiplets and a heat spreader bonded to the second package level with a metallic layer. The chiplets may be connected with optical interconnect paths.

• Wafer reconstitution is used to form semiconductor packages
• Packages may include integrated heat spreaders
• Metallic layer bonding with intermetallic compounds is used to attach the heat spreader
• Chiplets are present in multiple package levels
• Chiplets may be connected with optical interconnect paths

Potential Applications

The technology described in this patent application could be applied in:

• High-performance computing
• Data centers
• Telecommunications equipment

Problems Solved

This technology helps address issues such as:

• Thermal management in semiconductor packages
• Increasing interconnectivity between chiplets
• Improving overall performance and reliability of electronic devices

Benefits

The benefits of this technology include:

• Enhanced thermal dissipation
• Improved signal transmission between chiplets
• Higher efficiency and performance of semiconductor packages

Potential Commercial Applications

This technology could have commercial applications in:

• Semiconductor manufacturing industry
• Electronics and consumer devices market
• Aerospace and defense sector

Possible Prior Art

One possible prior art in this field is the use of heat spreaders in semiconductor packages to improve thermal management and performance. Another could be the integration of optical interconnect paths to enhance connectivity between chiplets.

Unanswered Questions

How does this technology compare to traditional semiconductor packaging methods in terms of cost-effectiveness?

The article does not provide information on the cost implications of implementing this technology compared to conventional packaging methods.

What are the potential challenges or limitations of using optical interconnect paths in semiconductor packages?

The article does not address any potential drawbacks or obstacles that may arise from incorporating optical interconnect paths in semiconductor packages.

Original Abstract Submitted

semiconductor packages formed utilizing wafer reconstitution and optionally including an integrated heat spreader and methods of fabrication are described. in an embodiment, a semiconductor package includes a first package level, a second package level including one or more second-level chiplets. a heat spreader may be bonded to the second package level with a metallic layer, which may include one or more intermetallic compounds formed by transient liquid phase bonding. the chiplets within the first and/or second package levels may optionally be connected with one or more optical interconnect paths.