Advanced micro devices, inc. (20240114664). COMPONENT COOLER WITH SPRING MECHANISM simplified abstract
Contents
- 1 COMPONENT COOLER WITH SPRING MECHANISM
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 COMPONENT COOLER WITH SPRING MECHANISM - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 How does the apparatus handle varying heat loads from different components in a system?
- 1.11 What materials are used in the construction of the heat transfer element and the manifold?
- 1.12 Original Abstract Submitted
COMPONENT COOLER WITH SPRING MECHANISM
Organization Name
Inventor(s)
ROBERT EDWARD Radke of AUSTIN TX (US)
COMPONENT COOLER WITH SPRING MECHANISM - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240114664 titled 'COMPONENT COOLER WITH SPRING MECHANISM
Simplified Explanation
The apparatus described in the patent application is designed for component cooling, specifically for heat-generating components. It includes a manifold, a heat transfer element, and a first spring mechanism to apply force to the heat transfer element.
- The apparatus is configured to cool heat-generating components by transferring heat away from them.
- The first spring mechanism ensures proper contact between the heat transfer element and the component.
- The manifold helps distribute cooling fluid or air to the heat transfer element.
- The design aims to efficiently and effectively cool components to prevent overheating and potential damage.
Potential Applications
The technology can be applied in various industries where heat-generating components require efficient cooling, such as:
- Electronics manufacturing
- Automotive industry
- Aerospace and aviation sector
Problems Solved
The apparatus addresses the following issues:
- Overheating of components leading to performance degradation or failure
- Inadequate cooling solutions for high-power components
- Uneven distribution of cooling across components
Benefits
The benefits of this technology include:
- Improved performance and longevity of heat-generating components
- Enhanced reliability and stability of systems
- Energy efficiency through targeted cooling solutions
Potential Commercial Applications
With its versatile applications, the technology can be commercially utilized in:
- Manufacturing and assembly of electronic devices
- Automotive cooling systems
- HVAC systems for buildings and industrial facilities
Possible Prior Art
One possible prior art could be traditional cooling systems using fans or heat sinks to dissipate heat from components. However, the specific design of the apparatus with the manifold and spring mechanism may offer unique advantages in terms of efficiency and effectiveness.
Unanswered Questions
How does the apparatus handle varying heat loads from different components in a system?
The patent application does not specify how the apparatus adjusts to different heat loads within a system. It would be beneficial to understand if the design can adapt to varying cooling requirements.
What materials are used in the construction of the heat transfer element and the manifold?
The patent application does not mention the specific materials used in the construction of these components. Knowing the materials could provide insights into the durability and thermal conductivity of the apparatus.
Original Abstract Submitted
an apparatus for component cooling includes a manifold and a heat transfer element configured to be thermally coupled to a heat-generating component. the apparatus further includes a first spring mechanism between the manifold and the heat transfer element. the first spring mechanism is configured to apply a first force to the heat transfer element.
