Advanced micro devices, inc. (20240114646). SUB-COOLING COMPONENTS USING THERMOELECTRIC COOLING simplified abstract
Contents
- 1 SUB-COOLING COMPONENTS USING THERMOELECTRIC COOLING
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUB-COOLING COMPONENTS USING THERMOELECTRIC COOLING - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SUB-COOLING COMPONENTS USING THERMOELECTRIC COOLING
Organization Name
Inventor(s)
CHRISTOPHER M. Jaggers of AUSTIN TX (US)
CHRISTOPHER M. Helberg of AUSTIN TX (US)
SUB-COOLING COMPONENTS USING THERMOELECTRIC COOLING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240114646 titled 'SUB-COOLING COMPONENTS USING THERMOELECTRIC COOLING
Simplified Explanation
The apparatus described in the patent application is designed to sub-cool components by using a combination of a component cooling device, a processor, an electronic component, a fan, and a thermoelectric cooling device. The thermoelectric cooling device is responsible for cooling the airflow from a higher temperature to a lower temperature.
- Component cooling device
- Processor thermally coupled to the component cooling device
- Electronic component
- Fan directing airflow across the processor and electronic component
- Thermoelectric cooling device cooling the airflow from a first temperature to a second temperature
Potential Applications
The technology described in the patent application could be used in various electronic devices such as computers, servers, and other devices that require efficient cooling systems to maintain optimal performance.
Problems Solved
This technology solves the problem of overheating in electronic components, which can lead to performance issues and even damage to the components. By sub-cooling the components, the apparatus ensures that they operate within safe temperature ranges.
Benefits
The benefits of this technology include improved performance and longevity of electronic components, reduced risk of overheating-related malfunctions, and increased efficiency in cooling systems.
Potential Commercial Applications
One potential commercial application of this technology could be in the manufacturing of high-performance computers and servers where efficient cooling systems are essential for optimal performance.
Possible Prior Art
One possible prior art for this technology could be existing cooling systems used in electronic devices, such as heat sinks, fans, and liquid cooling systems.
Unanswered Questions
How does the efficiency of this cooling system compare to traditional cooling methods?
The article does not provide information on the efficiency of this cooling system compared to traditional methods. Further research or testing would be needed to determine the effectiveness of this technology in real-world applications.
Are there any limitations to the size or type of components that can be effectively cooled using this apparatus?
The article does not address any potential limitations in terms of the size or type of components that can be effectively cooled using this apparatus. It would be important to investigate whether this technology is suitable for a wide range of electronic devices or if there are specific requirements for its implementation.
Original Abstract Submitted
an apparatus for sub-cooling components includes a component cooling device, a processor thermally coupled to the component cooling device, an electronic component, a fan configured to direct an airflow across the processor and the electronic component, and a thermoelectric cooling device thermally coupled to the component cooling device. the thermoelectric cooling device is configured to cool the airflow from a first temperature to a second temperature.
