Advanced micro devices, inc. (20240111710). NON-HOMOGENEOUS CHIPLETS simplified abstract
Contents
- 1 NON-HOMOGENEOUS CHIPLETS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 NON-HOMOGENEOUS CHIPLETS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
NON-HOMOGENEOUS CHIPLETS
Organization Name
Inventor(s)
Matthaeus G. Chajdas of Munich (DE)
NON-HOMOGENEOUS CHIPLETS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240111710 titled 'NON-HOMOGENEOUS CHIPLETS
Simplified Explanation
A semiconductor module includes multiple non-homogeneous semiconductor dies with different circuitry modules, interconnected to process commands based on individual capabilities.
- Multiple non-homogeneous semiconductor dies on the module
- Each die has common circuitry modules and distinct supporting circuitry modules
- Interconnect links the semiconductor dies together
- Commands routed based on capabilities of circuitry modules on each die
Potential Applications
This technology could be applied in:
- High-performance computing
- Data centers
- Automotive electronics
Problems Solved
- Efficient processing of commands
- Optimization of circuitry modules
- Enhanced performance in semiconductor modules
Benefits
- Improved processing capabilities
- Customized circuitry for specific tasks
- Enhanced overall performance
Potential Commercial Applications
Optimizing Semiconductor Module Circuitry for Improved Performance
Possible Prior Art
Prior art in semiconductor module design includes:
- Multi-die packaging techniques
- Interconnect technologies for semiconductor dies
Unanswered Questions
How does this technology impact power consumption in semiconductor modules?
The article does not address the potential impact of this technology on power consumption in semiconductor modules.
What are the limitations of routing commands based on individual circuitry capabilities?
The article does not discuss any limitations or challenges associated with routing commands in this manner.
Original Abstract Submitted
a semiconductor module comprises multiple non-homogeneous semiconductor dies disposed on the semiconductor module, with each semiconductor die having a set of circuitry modules that are common to all of the semiconductor dies and also a set of supporting circuitry modules that are distinct between the semiconductor dies. an interconnect communicatively couples the semiconductor dies together. commands for processing by the semiconductor module may be routed to individual semiconductor dies based on capabilities of the particular circuitry modules disposed on those individual semiconductor dies.
