View source for 20240085812.SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD simplified abstract (samsung electronics co., ltd.)

=SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD=


==Organization Name==

[[:Category:samsung electronics co., ltd.|samsung electronics co., ltd.]]


[[Category:samsung electronics co., ltd.]]

==Inventor(s)==

[[:Category:Kyuhee Han of Suwon-si (KR)|Kyuhee Han of Suwon-si (KR)]][[Category:Kyuhee Han of Suwon-si (KR)]]

[[:Category:Koungmin Ryu of Suwon-si (KR)|Koungmin Ryu of Suwon-si (KR)]][[Category:Koungmin Ryu of Suwon-si (KR)]]

[[:Category:Kyeongbeom Park of Suwon-si (KR)|Kyeongbeom Park of Suwon-si (KR)]][[Category:Kyeongbeom Park of Suwon-si (KR)]]

[[:Category:Jongmin Baek of Suwon-si (KR)|Jongmin Baek of Suwon-si (KR)]][[Category:Jongmin Baek of Suwon-si (KR)]]

[[:Category:Wookyung You of Suwon-si (KR)|Wookyung You of Suwon-si (KR)]][[Category:Wookyung You of Suwon-si (KR)]]

[[:Category:Woojin Lee of Suwon-si (KR)|Woojin Lee of Suwon-si (KR)]][[Category:Woojin Lee of Suwon-si (KR)]]

[[:Category:Juhee Lee of Suwon-si (KR)|Juhee Lee of Suwon-si (KR)]][[Category:Juhee Lee of Suwon-si (KR)]]

==SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD - A simplified explanation of the abstract==


This abstract first appeared for US patent application 20240085812 titled 'SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD

==Simplified Explanation==

The patent application describes a substrate processing apparatus with a chamber for processing a substrate, a light source to harden a photoresist pattern on the substrate, and a transparent division part separating the light source from the substrate within the chamber.

* The substrate processing apparatus includes a chamber with an internal space for processing a substrate.
* A light source is used to emit light on the substrate to harden a photoresist pattern on it.
* A transparent division part divides the chamber into a space for the light source and a space for the substrate.

== Potential Applications ==
This technology can be used in semiconductor manufacturing processes, photolithography, and other industries requiring precise substrate processing.

== Problems Solved ==
This technology solves the problem of accurately and efficiently hardening photoresist patterns on substrates without interference or contamination.

== Benefits ==
The benefits of this technology include improved accuracy, efficiency, and quality in substrate processing, leading to higher yields and reduced production costs.

== Potential Commercial Applications ==
Potential commercial applications of this technology include semiconductor fabrication facilities, research institutions, and companies involved in microelectronics manufacturing.

== Possible Prior Art ==
One possible prior art for this technology could be similar substrate processing apparatus with a different configuration or design.

=== Unanswered Questions ===

=== How does the transparent division part prevent contamination between the light source and the substrate during processing? ===
The transparent division part acts as a barrier between the light source and the substrate, ensuring that no particles or contaminants from the light source can reach the substrate during processing.

=== What is the specific wavelength of light emitted by the light source to harden the photoresist pattern on the substrate? ===
The specific wavelength of light emitted by the light source is optimized to effectively harden the photoresist pattern on the substrate without causing damage or overheating.


==Original Abstract Submitted==

a substrate processing apparatus includes a chamber having an internal space configured to process a substrate loaded therein; a light source configured to emit light on the substrate to harden a photoresist pattern coated on the substrate; and a transparent division part provided between the substrate and the light source, wherein the transparent division part divides the chamber into a first space, in which the light source is provided, and a second space, in which the substrate is provided.



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