20240079782.Ultra-wideband Antenna Assembly simplified abstract (apple inc.)

Ultra-wideband Antenna Assembly

Organization Name

apple inc.

Inventor(s)

Alden T. Rush of San Diego CA (US)

Han Wang of Campbell CA (US)

Jingni Zhong of Santa Clara CA (US)

Ming Chen of Cupertino CA (US)

Yiren Wang of Cupertino CA (US)

Yuan Tao of Santa Clara CA (US)

Hao Xu of Cupertino CA (US)

Hongfei Hu of Cupertino CA (US)

Mattia Pascolini of San Francisco CA (US)

Ultra-wideband Antenna Assembly - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240079782 titled 'Ultra-wideband Antenna Assembly

Simplified Explanation

The abstract describes an electronic device with an antenna mounted on substrates within a housing, including a dielectric cover, conductive plate, and mid-chassis. The antenna conveys ultra-wideband signals through the air gap, opening, and dielectric cover layer.

• Antenna mounted on substrates within housing
• Conductive patch extending from conductive ring on first substrate
• Conductive plate with opening aligned with conductive patch
• Air gap separating first substrate from dielectric cover
• Conductive gasket coupling conductive ring to conductive plate
• Antenna conveying ultra-wideband signals through air gap, opening, and dielectric cover layer

Potential Applications

This technology could be applied in wireless communication devices, IoT devices, and radar systems.

Problems Solved

This technology solves the problem of efficiently transmitting ultra-wideband signals through different layers of a device while maintaining signal integrity.

Benefits

The benefits of this technology include improved signal transmission, reduced interference, and compact design for electronic devices.

Potential Commercial Applications

The potential commercial applications of this technology include smartphones, smart home devices, and automotive radar systems.

Possible Prior Art

One possible prior art could be similar antenna structures used in electronic devices for signal transmission.

How does this technology impact the overall performance of the electronic device?

This article does not provide specific details on how the technology impacts the overall performance of the electronic device. It would be interesting to know if there are any performance metrics or comparisons with existing technologies.

What are the manufacturing considerations for implementing this technology in mass production?

The article does not address the manufacturing considerations for mass production of devices using this technology. Understanding the production challenges and costs associated with implementing this innovation could be crucial for commercial viability.

Original Abstract Submitted

an electronic device may be provided with a housing and an antenna. the antenna may be on a first substrate mounted to a second substrate. the housing may include a dielectric cover, a conductive plate on the dielectric cover, and a mid-chassis. the second substrate may be mounted to the mid-chassis. the antenna may include a conductive patch extending from a segment of a conductive ring on the first substrate. the conductive plate may have an opening aligned with the conductive patch. the first substrate may be separated from the dielectric cover by an air gap. a conductive gasket may couple the conductive ring to the conductive plate and may laterally surround the air gap and the opening. the antenna may convey ultra-wideband (uwb) signals through the air gap, the opening, and the dielectric cover layer.