20240079779.Electronic Device with Antenna Grounding Through Sensor Module simplified abstract (apple inc.)

Electronic Device with Antenna Grounding Through Sensor Module

Organization Name

apple inc.

Inventor(s)

Yuan Tao of Santa Clara CA (US)

Yiren Wang of Cupertino CA (US)

Ana Papio Toda of San Jose CA (US)

Jingni Zhong of Santa Clara CA (US)

Han Wang of Campbell CA (US)

Hao Xu of Cupertino CA (US)

Hongfei Hu of Cupertino CA (US)

Mattia Pascolini of San Francisco CA (US)

Eric W. Bates of San Jose CA (US)

Peter A. Dvorak of Menlo Park CA (US)

Allegra Shum of Menlo Park CA (US)

Electronic Device with Antenna Grounding Through Sensor Module - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240079779 titled 'Electronic Device with Antenna Grounding Through Sensor Module

Simplified Explanation

The abstract describes an electronic device with a sensor module and an antenna, where the tuner is mounted to a printed circuit overlapping the sensor module. A spring couples the tuner to the conductive chassis of the sensor module, and the sensor module includes optical sensors that gather data through a display. Ground paths are formed from the tuner to the ground structures, and conductive interconnect structures exert biasing forces to couple the ground paths to different layers of the ground structures, maximizing antenna performance.

• Sensor module and antenna with tuner mounted to a printed circuit.
• Spring couples tuner to conductive chassis of sensor module.
• Optical sensors gather data through a display.
• Ground paths formed from tuner to ground structures.
• Conductive interconnect structures exert biasing forces to couple ground paths to different layers of ground structures.

Potential Applications

The technology described in the patent application could be applied in various industries such as telecommunications, IoT devices, and smart home systems.

Problems Solved

This technology solves the problem of maximizing antenna performance despite the presence of a sensor module, by efficiently coupling the antenna to the ground structures.

Benefits

The benefits of this technology include improved antenna performance, enhanced data gathering capabilities through optical sensors, and efficient ground path coupling.

Potential Commercial Applications

The potential commercial applications of this technology include smart devices, wireless communication systems, and sensor networks.

Possible Prior Art

One possible prior art for this technology could be the use of conductive interconnect structures in electronic devices to improve antenna performance.

How does this technology impact the overall size of the electronic device?

The abstract does not provide information on whether this technology affects the size of the electronic device. It would be important to understand if there are any size constraints or advantages associated with implementing this technology.

What materials are used in the construction of the sensor module and antenna components?

The abstract does not specify the materials used in the construction of the sensor module and antenna components. Understanding the materials could provide insights into the durability and performance of the device.

Original Abstract Submitted

an electronic device may be provided with a sensor module and an antenna having an antenna arm, ground structures, and a tuner. the tuner may be mounted to a printed circuit overlapping the sensor module. a spring may be mounted to the printed circuit and may couple the tuner to a conductive chassis of the sensor module. the sensor module may include optical sensors that gather sensor data through a display and may form ground paths from the tuner to the ground structures. conductive interconnect structures such as springs may exert biasing forces in different directions to couple the ground paths to different layers of the ground structures. this may serve to couple the antenna to the ground structures as close as possible to the tuner, thereby maximizing antenna performance, despite the presence of the sensor module.