Stacked multi-spectral image sensor

The multispectral sensing device described in the abstract combines two dies, each with a different array of sensor elements, to capture optical radiation in different wavelength bands. The device includes readout circuitry to process the electrical signals generated by the sensor elements.

The device includes a first die with a patterned array of sensor elements sensitive to wavelengths below 1000 nm.
A second die is bonded to the first die and has a patterned array of sensor elements sensitive to wavelengths above 1000 nm.
Readout circuitry reads the electrical signals generated by the sensor elements in both dies.

Potential Applications

The multispectral sensing device can be used in various applications such as:

Agriculture for monitoring crop health and growth
Environmental monitoring for analyzing water quality and pollution levels
Remote sensing for earth observation and climate studies

Problems Solved

This technology addresses the following issues:

Limited spectral range coverage in traditional sensors
Inability to capture multiple wavelength bands simultaneously
Lack of compact and integrated multispectral sensing solutions

Benefits

The benefits of this technology include:

Enhanced spectral imaging capabilities
Improved data collection for scientific research and analysis
Compact and efficient design for easy integration into different systems

Potential Commercial Applications

The multispectral sensing device can be applied in commercial sectors such as:

Aerospace and defense for surveillance and reconnaissance
Medical imaging for diagnostic purposes
Industrial automation for quality control and inspection processes

Possible Prior Art

One possible prior art for multispectral sensing devices is the use of separate sensors for different wavelength bands, which may lack integration and efficiency compared to the described technology.

Unanswered Questions

How does the device handle calibration and maintenance to ensure accurate and reliable performance over time?

The abstract does not provide information on the calibration process or maintenance requirements of the multispectral sensing device.

What are the power consumption and heat dissipation characteristics of the device, especially when operating in different environmental conditions?

The abstract does not mention the power consumption or thermal management aspects of the multispectral sensing device.

Original Abstract Submitted

a multispectral sensing device includes a first die, including silicon, which is patterned to define a first array of sensor elements, which output first electrical signals in response to optical radiation that is incident on the device in a band of wavelengths less than 1000 nm that is incident on the front side of the first die. a second die has its first side bonded to the back side of the first die and includes a photosensitive material and is patterned to define a second array of sensor elements, which output second electrical signals in response to the optical radiation that is incident on the device in a second band of wavelengths greater than 1000 nm that passes through the first die and is incident on the first side of the second die. readout circuitry reads the first electrical signals and the second electrical signals serially out of the device.

20240079440.Stacked multi-spectral image sensor simplified abstract (apple inc.)

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Stacked multi-spectral image sensor

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