20240075713.ELECTRONIC DEVICE HAVING A GLASS COMPONENT WITH CRACK HINDERING INTERNAL STRESS REGIONS simplified abstract (apple inc.)
Contents
- 1 ELECTRONIC DEVICE HAVING A GLASS COMPONENT WITH CRACK HINDERING INTERNAL STRESS REGIONS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ELECTRONIC DEVICE HAVING A GLASS COMPONENT WITH CRACK HINDERING INTERNAL STRESS REGIONS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
ELECTRONIC DEVICE HAVING A GLASS COMPONENT WITH CRACK HINDERING INTERNAL STRESS REGIONS
Organization Name
Inventor(s)
Christopher C. Bartlow of Menlo Park CA (US)
Dale N. Memering of Langhome PA (US)
Tyler A. Marshall of Sunnyvale CA (US)
Victor Luzzato of Santa Clara CA (US)
ELECTRONIC DEVICE HAVING A GLASS COMPONENT WITH CRACK HINDERING INTERNAL STRESS REGIONS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240075713 titled 'ELECTRONIC DEVICE HAVING A GLASS COMPONENT WITH CRACK HINDERING INTERNAL STRESS REGIONS
Simplified Explanation
The patent application discloses a component for an electronic device with an internal compressive stress region, which can be in a glass or glass ceramic portion of the component.
- The component for an electronic device includes an internal compressive stress region.
- The internal compressive stress region can be created in a glass or glass ceramic portion of the component.
- The patent application also covers electronic devices comprising these components and methods for making them.
Potential Applications
The technology described in the patent application could be applied in various electronic devices such as smartphones, tablets, laptops, and wearables.
Problems Solved
This technology helps improve the structural integrity and durability of electronic components, reducing the risk of damage from external forces or impacts.
Benefits
- Enhanced strength and resilience of electronic components - Increased lifespan of electronic devices - Improved performance under stress or impact conditions
Potential Commercial Applications
"Enhancing Durability of Electronic Components with Internal Compressive Stress Region"
Possible Prior Art
There may be prior art related to the use of internal stress regions in electronic components to improve their mechanical properties and longevity.
Unanswered Questions
How does the internal compressive stress region affect the overall performance of the electronic device?
The article does not delve into the specific impact of the internal compressive stress region on the functionality or efficiency of the electronic device.
Are there any limitations or drawbacks to implementing this technology in electronic components?
The potential drawbacks or challenges associated with integrating internal compressive stress regions in electronic components are not addressed in the article.
Original Abstract Submitted
a component for an electronic device including an internal compressive stress region is disclosed herein. the internal compressive stress region may be created in a glass portion of the component or in a glass ceramic portion of the component. electronic devices comprising the components and method for making the components are also disclosed.
