20240074665.CORE TEMPERATURE SENSING WITH WEARABLE ELECTRONIC DEVICE simplified abstract (apple inc.)

CORE TEMPERATURE SENSING WITH WEARABLE ELECTRONIC DEVICE

Organization Name

apple inc.

Inventor(s)

Daniel J. Hiemstra of San Francisco CA (US)

Jeffrey W. Buchholz of Santa Cruz CA (US)

Xiaofan Niu of San Jose CA (US)

James C. Clements of Campbell CA (US)

Wei Lin of Santa Clara CA (US)

Habib S. Karaki of Sunnyvale CA (US)

Paul Mansky of San Francisco CA (US)

Boyi Fu of San Jose CA (US)

Yanfeng Chen of San Ramon CA (US)

Edmilson Besseler of Foster City CA (US)

CORE TEMPERATURE SENSING WITH WEARABLE ELECTRONIC DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240074665 titled 'CORE TEMPERATURE SENSING WITH WEARABLE ELECTRONIC DEVICE

Simplified Explanation

The abstract describes an electronic device with a housing, front and rear openings, a display component, a rear cover, a logic board, and a thin film thermopile.

• The electronic device has a housing with front and rear openings.
• It includes a display component at the front opening and a rear cover at the rear opening.
• A logic board is housed inside the device.
• The device features a thin film thermopile with a cold junction bonded to the logic board and a hot junction bonded to the rear cover.

Potential Applications

The technology described in this patent application could be applied in various electronic devices such as smartphones, tablets, laptops, and other portable gadgets.

Problems Solved

This technology helps in efficiently managing the heat generated by electronic devices, ensuring optimal performance and preventing overheating issues.

Benefits

The use of a thin film thermopile in electronic devices can improve thermal management, enhance device performance, and increase overall reliability.

Potential Commercial Applications

The technology could be utilized in the consumer electronics industry for developing advanced and efficient electronic devices with improved thermal control.

Possible Prior Art

One possible prior art could be the use of traditional heat sinks or fans for thermal management in electronic devices.

What is the manufacturing process for the thin film thermopile described in the patent application?

The manufacturing process for the thin film thermopile involves bonding a cold junction to the logic board and a hot junction to the rear cover, ensuring proper heat dissipation.

How does the thin film thermopile improve the overall efficiency of electronic devices?

The thin film thermopile helps in effectively managing heat distribution within the device, preventing overheating and ensuring optimal performance.

Original Abstract Submitted

an electronic device includes a housing defining an internal volume, a front opening, and a rear opening. the electronic device can include a display component disposed at the front opening and a rear cover disposed at the rear opening. a logic board can be disposed in the internal volume. the device can also include a thin film thermopile including a cold junction bonded to the logic board and a hot junction bonded to the rear cover.