20240057261. MICRO SOLDER JOINT AND STENCIL APERTURE DESIGN simplified abstract (Western Digital Technologies, Inc.)

MICRO SOLDER JOINT AND STENCIL APERTURE DESIGN

Organization Name

Western Digital Technologies, Inc.

Inventor(s)

John Patrick Burke of San Jose CA (US)

Ibrahym Bin Ahmad of Parit Buntar (MY)

Fakhrozi Bin Che Ani of Bukit Mertajam (MY)

Mohamad Solehin Bin Mohamed Sunar of Bagan Serai (MY)

Peir Ming Sing of Bukit Mertajam (MY)

Hari kiran Raavi of Dublin CA (US)

MICRO SOLDER JOINT AND STENCIL APERTURE DESIGN - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240057261 titled 'MICRO SOLDER JOINT AND STENCIL APERTURE DESIGN

Simplified Explanation

The abstract describes a stencil design for depositing solder on a printed circuit board, ensuring that the solder joint formed is non-convex and does not extend beyond the edges of the PCB pad and surface mount component terminal.

• Stencil design for depositing solder on a PCB
• Aperture wall does not extend beyond PCB pad or component terminal
• Forms non-convex solder joint between PCB pad and component terminal

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1. 1. 1. Potential Applications

• Electronics manufacturing
• PCB assembly
• Surface mount technology

1. 1. 1. Problems Solved

• Ensures proper solder joint formation
• Prevents solder from extending beyond PCB pad and component terminal

1. 1. 1. Benefits

• Improved reliability of solder joints
• Prevents short circuits
• Enhances overall quality of PCB assembly

Original Abstract Submitted

micro solder joint and stencil design. in one embodiment, a stencil for depositing solder on a printed circuit board (pcb) includes a plurality of stencil apertures, a first stencil aperture of the plurality of apertures having an aperture wall defining an aperture perimeter. the aperture wall is configured to not extend beyond an outer edge of a pcb pad provided on the printed circuit board, the aperture wall is also configured to not extend beyond an outer edge of a terminal of a surface mount component, and the first stencil aperture is configured to receive solder paste to form a non-convex solder joint between the pcb pad and the terminal.