20240052558. THERMAL INTERFACE MATERIALS COMPRISING ALIGNED FIBERS AND MATERIALS SUCH AS SOLDER, ALLOYS, AND/OR OTHER METALS simplified abstract (Boston Materials, Inc.)
THERMAL INTERFACE MATERIALS COMPRISING ALIGNED FIBERS AND MATERIALS SUCH AS SOLDER, ALLOYS, AND/OR OTHER METALS
Organization Name
Inventor(s)
Rafael Padilla, Jr. of San Leandro CA (US)
Chunzhou Pan of Quincy MA (US)
THERMAL INTERFACE MATERIALS COMPRISING ALIGNED FIBERS AND MATERIALS SUCH AS SOLDER, ALLOYS, AND/OR OTHER METALS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240052558 titled 'THERMAL INTERFACE MATERIALS COMPRISING ALIGNED FIBERS AND MATERIALS SUCH AS SOLDER, ALLOYS, AND/OR OTHER METALS
Simplified Explanation
The present disclosure relates to thermally conductive materials for use in semiconductor devices or other applications, including materials with aligned fibers such as carbon fibers and a metal such as solder.
- Aligned fibers, such as carbon fibers, are used in combination with metals like solder to create thermally conductive materials.
- The metal may have a low melting temperature and can be present within a transition metal rich solder alloy or other conductive mediums.
- The metal may react with the carbon fibers to form metal carbides, facilitating contact between the metal and the fibers.
- Potential Applications:**
- Semiconductor devices - Heat sinks - Electronic packaging
- Problems Solved:**
- Improving thermal conductivity in semiconductor devices - Enhancing heat dissipation in electronic components
- Benefits:**
- Increased efficiency in heat transfer - Improved performance and reliability of electronic devices - Enhanced thermal management capabilities
Original Abstract Submitted
the present disclosure is generally directed to a variety of thermally conductive materials for use in semiconductor devices or other applications. in some cases, the materials may include aligned fibers such as carbon fibers, e.g., defining a substrate, and a metal such as solder. in some cases, the metal may be present within a transition metal rich solder alloy, a conductive medium such as a conductive ink, a thermal chemical vapor deposited solder, an oxide coated liquid metal, an oxide coated liquid metal transition metal rich solder alloy, etc. the metal may have a relatively low melting temperature in certain embodiments. the metal may be interspersed or infiltrated between the plurality of discontinuous fibers, and/or surround at least some of the fibers. in some cases, the metal may react with the carbon fibers to form metal carbides and/or diffuse into the carbon fibers, which may facilitate contact between the metal and the carbon fibers. other aspects are generally directed to devices using such compositions, methods of making such compositions, kits including such compositions, or the like.
