20240051819. METHOD FOR MANUFACTURING MEMS DEVICE AND MEMS DEVICE simplified abstract (AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.)

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METHOD FOR MANUFACTURING MEMS DEVICE AND MEMS DEVICE

Organization Name

AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD.

Inventor(s)

Ping-He Chang of Hsinchu (CN)

Kahkeen Lai of Singapore (SG)

METHOD FOR MANUFACTURING MEMS DEVICE AND MEMS DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240051819 titled 'METHOD FOR MANUFACTURING MEMS DEVICE AND MEMS DEVICE

Simplified Explanation

The patent application describes a method for manufacturing a MEMS (Micro-Electro-Mechanical Systems) device. The method involves depositing a thin film on a sacrificial layer, machining the thin film to create through holes, removing material from the sacrificial layer through the through holes to create a cavity, and sealing the through holes with a sealing layer.

  • The method simplifies the manufacturing process by only requiring the deposition of one layer of thin film.
  • This reduces the production period and makes the manufacturing process more efficient.
  • The method provides reliable on-site sealing capability, ensuring the integrity of the MEMS device.

Potential Applications

This technology can be applied in various industries and fields, including:

  • Electronics: MEMS devices are used in sensors, actuators, and microelectronics.
  • Medical: MEMS devices can be used in medical implants, drug delivery systems, and diagnostic tools.
  • Automotive: MEMS devices are used in airbag deployment systems, tire pressure monitoring, and engine control systems.
  • Aerospace: MEMS devices can be used in navigation systems, satellite communication, and aircraft control systems.

Problems Solved

The method described in the patent application solves several problems in the manufacturing of MEMS devices:

  • Simplifies the manufacturing process by reducing the number of deposition layers required.
  • Shortens the production period, leading to cost savings and faster time-to-market.
  • Provides reliable on-site sealing capability, ensuring the functionality and longevity of the MEMS device.

Benefits

The use of this technology offers several benefits:

  • Increased efficiency in the manufacturing process.
  • Cost savings due to reduced material and production time.
  • Improved reliability and functionality of MEMS devices.
  • Expanded applications in various industries.


Original Abstract Submitted

a method for manufacturing a mems device and the mems device are provided. the method includes: depositing a film on at least a part of a surface of a sacrificial layer, defining at least one through hole in the thin film by machining, removing at least a part of a material covered by the thin film in the sacrificial layer, discharging the part of the material removed from the sacrificial layer from the at least one through hole to define a cavity in the sacrificial layer, and depositing a sealing layer on a surface of the thin film facing away from the sacrificial layer to seal the at least one through hole. compared with the manufacturing method in the related art, the manufacturing method of the disclosure only requires to deposit one layer of thin film, shorten the production period, and has reliable on-site sealing capability.

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