20240050990. APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING A SUBSTRATE simplified abstract (SEMES CO., LTD.)
Contents
APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING A SUBSTRATE
Organization Name
Inventor(s)
Do Hyung Kim of Seocheon-gun (KR)
Dae Hun Kim of Pyeongtaek-si (KR)
Young Jin Kim of Cheonan-si (KR)
Young Joon Han of Cheonan-si (KR)
Eun Hyeok Choi of Cheonan-si (KR)
APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING A SUBSTRATE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240050990 titled 'APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING A SUBSTRATE
Simplified Explanation
The inventive concept is a substrate treating apparatus that includes a housing with a treating space, a support unit for holding the substrate in the treating space, and a brush unit for cleaning the substrate on the support unit. The brush unit consists of a body with a circular-shaped cross-section and multiple contact pads protruding from the body, creating groove portions for discharging foreign substances from the substrate. The width of the groove portion near the center of the body is different from the width near the edge.
- The substrate treating apparatus has a housing with a treating space.
- A support unit is included to hold the substrate in the treating space.
- A brush unit is used to clean the substrate on the support unit.
- The brush unit has a circular-shaped body with multiple contact pads.
- The contact pads define groove portions for discharging foreign substances.
- Each groove portion is located between adjacent contact pads.
- The width of the groove portion varies from the center to the edge of the body.
Potential Applications:
- This substrate treating apparatus can be used in various industries that require cleaning or treating substrates, such as semiconductor manufacturing, electronics assembly, or optical lens production.
- It can be applied in cleaning processes for removing contaminants or residues from substrates.
- The brush unit's design with contact pads and groove portions can effectively remove foreign substances from the substrate surface.
Problems Solved:
- The brush unit's design helps to prevent the accumulation of foreign substances on the substrate during the cleaning process.
- The groove portions allow for the efficient discharge of foreign substances, preventing recontamination of the substrate.
- The different widths of the groove portions help to optimize the cleaning performance by adapting to the varying levels of contamination across the substrate surface.
Benefits:
- Improved cleaning efficiency and effectiveness due to the brush unit's design.
- Reduced risk of recontamination of the substrate during the cleaning process.
- Enhanced substrate quality and reliability in industries that rely on clean and treated substrates.
- Potential cost savings by minimizing the need for additional cleaning steps or rework due to inadequate cleaning.
Original Abstract Submitted
the inventive concept provides a substrate treating apparatus. the substrate treating apparatus includes a housing having a treating space; a support unit configured to support a substrate in the treating space; and a brush unit configured to clean the substrate supported on the support unit, and wherein the brush unit includes: a body having a circular-shaped cross-section; and a plurality of contact pads protruding from the body and defining a plurality of groove portions for discharging foreign substances dropped from a substrate, each groove portion defined between adjacent contact pads, and wherein a width of the groove portion near a center of the body is different from a width of the groove portion near an edge of the body.
