20240049609. COUPLING COMPONENT APPLIED TO QUANTUM CHIP, QUANTUM CHIP AND QUANTUM COMPUTING DEVICE simplified abstract (Beijing Baidu Netcom Science Technology Co., Ltd.)
COUPLING COMPONENT APPLIED TO QUANTUM CHIP, QUANTUM CHIP AND QUANTUM COMPUTING DEVICE
Organization Name
Beijing Baidu Netcom Science Technology Co., Ltd.
Inventor(s)
COUPLING COMPONENT APPLIED TO QUANTUM CHIP, QUANTUM CHIP AND QUANTUM COMPUTING DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240049609 titled 'COUPLING COMPONENT APPLIED TO QUANTUM CHIP, QUANTUM CHIP AND QUANTUM COMPUTING DEVICE
Simplified Explanation
The abstract describes a coupling component used in a quantum chip, as well as the quantum chip itself and a quantum computing device. The coupling component consists of two electrode plates, each with two coupling ports. The abstract states that at least one of the following conditions is satisfied: the coupling strength between the first coupling port and a first qubit is different from the coupling strength between the second coupling port and a second qubit, and the coupling strength between the third coupling port and the first qubit is different from the coupling strength between the fourth coupling port and the second qubit.
- The coupling component is applied to a quantum chip, which is part of a quantum computing device.
- The coupling component includes two electrode plates, each with two coupling ports.
- The coupling strengths between the coupling ports and the qubits can be different.
Potential applications of this technology:
- Quantum computing: This technology can be used to enhance the performance and efficiency of quantum computing devices by allowing for different coupling strengths between qubits.
- Quantum communication: The coupling component can be used in quantum communication systems to enable controlled interactions between qubits.
Problems solved by this technology:
- In quantum computing, it is important to have precise control over the interactions between qubits. This technology solves the problem of achieving different coupling strengths between qubits, allowing for more flexibility and control in quantum computations.
Benefits of this technology:
- Improved performance: The ability to have different coupling strengths between qubits can lead to improved performance and efficiency in quantum computing.
- Enhanced control: This technology provides greater control over the interactions between qubits, allowing for more precise and tailored quantum computations.
- Versatility: The coupling component can be applied to various quantum computing devices, making it a versatile solution for enhancing quantum computing capabilities.
Original Abstract Submitted
provided is a coupling component applied to a quantum chip, a quantum chip and a quantum computing device. the coupling component includes a first electrode plate and a second electrode plate. the first electrode plate includes a first coupling port and a second coupling port. the second electrode plate includes a third coupling port and a fourth coupling port. at least one of the following conditions is satisfied: a first coupling strength formed by coupling the first coupling port with a first qubit is different from a second coupling strength formed by coupling the second coupling port with a second qubit, and a third coupling strength formed by coupling the third coupling port with the first qubit is different from a fourth coupling strength formed by coupling the fourth coupling port with the second qubit.
