20240049448. SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME simplified abstract (NANYA TECHNOLOGY CORPORATION)

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SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Organization Name

NANYA TECHNOLOGY CORPORATION

Inventor(s)

TSU-CHIEH Ai of TAITUNG CITY (TW)

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240049448 titled 'SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Simplified Explanation

The abstract describes a semiconductor device and a method of manufacturing it. The device includes a substrate and a conductive pad on the substrate, with the conductive pad having a recessed portion. The device also includes a capacitor structure partially disposed within the recessed portion of the conductive pad and electrically connected to the substrate through the conductive pad.

  • The semiconductor device includes a conductive pad with a recessed portion.
  • A capacitor structure is partially placed within the recessed portion of the conductive pad.
  • The capacitor structure is electrically connected to the substrate through the conductive pad.

Potential Applications:

  • This technology can be used in various electronic devices such as smartphones, tablets, and computers.
  • It can be applied in power management systems, integrated circuits, and memory devices.

Problems Solved:

  • The recessed portion of the conductive pad allows for the integration of a capacitor structure within the device, saving space.
  • The electrical connection between the capacitor structure and the substrate through the conductive pad ensures efficient performance.

Benefits:

  • The compact design of the semiconductor device allows for smaller and more efficient electronic devices.
  • The integration of the capacitor structure within the conductive pad improves the overall performance and functionality of the device.
  • The method of manufacturing the device provides a cost-effective and reliable solution for semiconductor production.


Original Abstract Submitted

a semiconductor device and a method of manufacturing a semiconductor device are provided. the semiconductor device includes a substrate and a conductive pad disposed on the substrate and having a first surface facing away from the substrate. the first surface of the conductive pad is recessed toward the substrate and defines a recessed portion. the semiconductor device also includes a capacitor structure at least partially disposed within the recessed portion of the conductive pad and electrically connected with the substrate through the conductive pad.

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