20240049401. SEMI-FLEX PRINTED CIRCUIT BOARD WITH COVER-OPENING OPENING simplified abstract (TRIPOD (WUXI) ELECTRONIC CO., LTD.)
Contents
SEMI-FLEX PRINTED CIRCUIT BOARD WITH COVER-OPENING OPENING
Organization Name
TRIPOD (WUXI) ELECTRONIC CO., LTD.
Inventor(s)
Cheng Ming Lu of WuXi City (CN)
Han-Ching Shih of WuXi City (CN)
Wen-Che Chen of WuXi City (CN)
Wu-Chiang Ma of WuXi City (CN)
SEMI-FLEX PRINTED CIRCUIT BOARD WITH COVER-OPENING OPENING - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240049401 titled 'SEMI-FLEX PRINTED CIRCUIT BOARD WITH COVER-OPENING OPENING
Simplified Explanation
The abstract describes a patent application for a semi-flex printed circuit board with a cover-opening opening. The core substrate of the circuit board surrounds the cover-opening opening, and two metal dam structures are arranged on a side surface of the core substrate to jointly surround the opening. The core board is placed on a side surface of the bonding sheet, away from the core substrate. Laser cutting sidewalls are provided on two sides of the bottom of the core substrate surrounding the opening, and these sidewalls are connected to the sidewalls of the metal dam structures. An obtuse angle is formed between the metal dam sidewall and the laser cutting sidewall.
- The patent application describes a semi-flex printed circuit board with a cover-opening opening.
- The core substrate surrounds the cover-opening opening and is connected to two metal dam structures.
- Laser cutting sidewalls are provided on the bottom of the core substrate surrounding the opening.
- The metal dam sidewalls and laser cutting sidewalls are connected to each other.
- The technology allows for the creation of a flexible circuit board with a cover-opening opening.
Potential applications of this technology:
- This technology can be used in electronic devices that require a semi-flexible circuit board with a cover-opening opening.
- It can be applied in devices where access to internal components is needed, such as smartphones or tablets.
Problems solved by this technology:
- The semi-flex printed circuit board with a cover-opening opening allows for easier access to internal components for maintenance or repairs.
- It provides a solution for devices that require a combination of flexibility and a cover-opening opening.
Benefits of this technology:
- The semi-flex printed circuit board with a cover-opening opening offers improved accessibility to internal components, reducing the time and effort required for maintenance or repairs.
- It provides flexibility in design and allows for the integration of a cover-opening opening without compromising the functionality of the circuit board.
Original Abstract Submitted
a semi-flex printed circuit board with cover-opening opening is disclosed. an inner side of the core substrate surrounds a cover-opening opening. the two metal dam structures are arranged on a side surface of the core substrate; and the two metal dam structures and the core substrate jointly surround the cover-opening opening. the core board is arranged on a side surface of the bonding sheet away from the core substrate. two sides of a bottom of the core substrate surrounding the cover-opening opening are provided with two laser cutting sidewalls respectively. sidewalls of the two metal dam structures surrounding the cover-opening opening are connected with the two laser cutting sidewalls respectively and each defined as a metal dam sidewall. an obtuse angle presents between the metal dam sidewall and the laser cutting sidewall.
