20240047271. METHOD OF MANUFACTURING MICROELECTRONIC DEVICES, RELATED DEVICES, SYSTEMS, AND APPARATUS simplified abstract (Micro Technology, Inc.)

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METHOD OF MANUFACTURING MICROELECTRONIC DEVICES, RELATED DEVICES, SYSTEMS, AND APPARATUS

Organization Name

Micro Technology, Inc.

Inventor(s)

Chih Kai Wang of Changhua County (TW)

METHOD OF MANUFACTURING MICROELECTRONIC DEVICES, RELATED DEVICES, SYSTEMS, AND APPARATUS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240047271 titled 'METHOD OF MANUFACTURING MICROELECTRONIC DEVICES, RELATED DEVICES, SYSTEMS, AND APPARATUS

Simplified Explanation

The abstract describes a system and method for stealth dicing a semiconductor wafer. The method involves implanting dopant ions into the wafer from the back side, creating a modified layer in the material of the wafer. The wafer is then fractured along the boundaries defined by the modified layer.

  • The method involves implanting dopant ions into a semiconductor wafer from the back side.
  • A laser beam is focused on an inside portion of the wafer through the back surface.
  • The laser beam forms a modified layer in the material of the wafer near the implanted dopant ions.
  • The wafer is fractured along the boundaries defined by the modified layer.

Potential applications of this technology:

  • Semiconductor manufacturing: This method can be used in the production of semiconductor wafers, allowing for stealth dicing and separation of individual chips.
  • Integrated circuit packaging: The stealth dicing technique can be applied to separate integrated circuits from a wafer, enabling their packaging into individual components.

Problems solved by this technology:

  • Improved yield: The stealth dicing method reduces the risk of damage to the semiconductor wafer during the dicing process, leading to higher yield rates.
  • Enhanced chip separation: The modified layer created by the laser beam allows for precise and controlled fracturing of the wafer, resulting in clean and accurate chip separation.

Benefits of this technology:

  • Cost reduction: The stealth dicing method eliminates the need for expensive and time-consuming mechanical dicing processes, reducing manufacturing costs.
  • Increased productivity: The use of laser beam technology enables faster and more efficient dicing, improving overall production throughput.
  • Enhanced chip quality: The controlled fracturing along the modified layer ensures clean and precise chip separation, leading to higher quality chips.


Original Abstract Submitted

a system and method for stealth dicing a semiconductor wafer. the method may include implanting dopant ions to a first depth in the semiconductor wafer through a back side of the semiconductor wafer. the method may further include focusing a laser beam at an inside portion of the wafer through the back surface of the wafer to form a modified layer in material of the semiconductor wafer proximate the first depth. the method may also include fracturing the semiconductor wafer along boundaries defined by the modified layer.

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