20240047253. SUBSTRATE LOADING APPARATUS, SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME, AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE USING THE SEMICONDUCTOR MANUFACTURING EQUIPMENT simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

SUBSTRATE LOADING APPARATUS, SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME, AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE USING THE SEMICONDUCTOR MANUFACTURING EQUIPMENT

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Sangho Jang of Suwon-si (KR)

Dongsoo Lee of Suwon-si (KR)

Kibeom Kil of Suwon-si (KR)

Yeongseok Kim of Suwon-si (KR)

Wooram Oh of Suwon-si (KR)

Youngshin Choi of Suwon-si (KR)

SUBSTRATE LOADING APPARATUS, SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME, AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE USING THE SEMICONDUCTOR MANUFACTURING EQUIPMENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240047253 titled 'SUBSTRATE LOADING APPARATUS, SEMICONDUCTOR MANUFACTURING EQUIPMENT INCLUDING THE SAME, AND METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE USING THE SEMICONDUCTOR MANUFACTURING EQUIPMENT

Simplified Explanation

The abstract describes a substrate loading apparatus that includes a pickup apparatus, an elevator with waiting spaces, a stage, and an insert apparatus. The pickup apparatus moves a magazine in different directions, while the elevator has waiting spaces to selectively receive the magazine. The stage supports the magazine, and the insert apparatus transfers substrates within the magazine. The pickup apparatus is positioned separately from the elevator and the stage in a specific direction.

• The apparatus is designed to move a magazine in multiple directions.
• The elevator has waiting spaces to receive the magazine.
• The stage supports the magazine.
• The insert apparatus transfers substrates within the magazine.
• The pickup apparatus is positioned separately from the elevator and the stage in a specific direction.

Potential applications of this technology:

• Semiconductor manufacturing: The substrate loading apparatus can be used in semiconductor fabrication processes to load and transfer substrates.
• Printed circuit board assembly: The apparatus can be utilized in the assembly of printed circuit boards, allowing for efficient loading and transfer of substrates.
• Optical device manufacturing: This technology can be applied in the production of optical devices, facilitating the loading and transfer of substrates.

Problems solved by this technology:

• Improved efficiency: The substrate loading apparatus streamlines the process of loading and transferring substrates, reducing manual labor and increasing productivity.
• Enhanced accuracy: The apparatus ensures precise positioning and handling of substrates, minimizing errors and improving overall quality.
• Space optimization: By separating the pickup apparatus from the elevator and stage, the apparatus allows for better space utilization in manufacturing facilities.

Benefits of this technology:

• Increased productivity: The efficient loading and transfer of substrates result in higher production rates and reduced downtime.
• Improved quality: The precise handling of substrates minimizes errors and defects, leading to higher-quality end products.
• Space-saving: The separation of the pickup apparatus from the elevator and stage optimizes space utilization in manufacturing environments.

Original Abstract Submitted

a substrate loading apparatus includes a pickup apparatus configured to move a magazine in a first direction, a second direction and a third direction, an elevator defining a plurality of waiting spaces, a stage configured to support the magazine, and an insert apparatus configured to transfer substrates in the magazine. at least one of the plurality of waiting spaces of the elevator is configured to selectively receive the magazine, and the pickup apparatus is spaced apart from the elevator and the stage in the third direction.