20240045340. METHOD FOR CONTROLLING A MANUFACTURING PROCESS AND ASSOCIATED APPARATUSES simplified abstract (ASML Netherlands B.V.)

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METHOD FOR CONTROLLING A MANUFACTURING PROCESS AND ASSOCIATED APPARATUSES

Organization Name

ASML Netherlands B.V.

Inventor(s)

Peter Ten Berge of Eindhoven (NL)

Steven Erik Steen of Veldhoven (NL)

Pieter Gerardus Jacobus Smorenberg of Rotterdam (NL)

Khalid Elbattay of Eindhoven (NL)

METHOD FOR CONTROLLING A MANUFACTURING PROCESS AND ASSOCIATED APPARATUSES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240045340 titled 'METHOD FOR CONTROLLING A MANUFACTURING PROCESS AND ASSOCIATED APPARATUSES

Simplified Explanation

The abstract describes a method for controlling the manufacturing process of semiconductor devices. The method involves obtaining control grids associated with lithographic apparatus used for patterning substrates, determining a common control grid definition for a bonding step, obtaining metrology data on the bonded substrate, and determining a correction for the bonding step based on the metrology data.

  • The method involves obtaining control grids for lithographic apparatus used in patterning substrates.
  • A common control grid definition is determined for the bonding step of the substrates.
  • Metrology data is obtained for the bonded substrate, including data related to metrology performed on it.
  • A correction for the bonding step is determined based on the metrology data.
  • The correction includes a co-optimized correction for the bonding step and the patterning processes.

Potential applications of this technology:

  • Semiconductor manufacturing industry
  • Electronics industry
  • Nanotechnology industry

Problems solved by this technology:

  • Ensures accurate bonding of substrates in the manufacturing process
  • Improves the performance and quality of semiconductor devices
  • Reduces defects and errors in the bonding and patterning processes

Benefits of this technology:

  • Enhanced control and accuracy in the manufacturing process
  • Improved yield and efficiency in semiconductor device production
  • Cost savings through reduced defects and errors
  • Enables co-optimization of bonding and patterning processes for better overall performance.


Original Abstract Submitted

a method for controlling a process of manufacturing semiconductor devices, the method including: obtaining a first control grid associated with a first lithographic apparatus used for a first patterning process for patterning a first substrate; obtaining a second control grid associated with a second lithographic apparatus used for a second patterning process for patterning a second substrate; based on the first control grid and second control grid, determining a common control grid definition for a bonding step for bonding the first substrate and second substrate to obtain a bonded substrate; obtaining bonded substrate metrology data including data relating to metrology performed on the bonded substrate; and determining a correction for performance of the bonding step based on the bonded substrate metrology data, the determining a correction including determining a co-optimized correction for the bonding step and for the first patterning process and/or second patterning process.

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