20240042788. MASK EXPOSURE METHOD, TRANSPARENT CONDUCTIVE METALLIZATION AND PIGMENT simplified abstract (GIESECKE+DEVRIENT CURRENCY TECHNOLOGY GMBH)

MASK EXPOSURE METHOD, TRANSPARENT CONDUCTIVE METALLIZATION AND PIGMENT

Organization Name

GIESECKE+DEVRIENT CURRENCY TECHNOLOGY GMBH

Inventor(s)

Winfried Hoffmuller of Bad Tolz (DE)

Michael Sobol of Munchen (DE)

Andreas Rauch of Ohlstadt (DE)

MASK EXPOSURE METHOD, TRANSPARENT CONDUCTIVE METALLIZATION AND PIGMENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240042788 titled 'MASK EXPOSURE METHOD, TRANSPARENT CONDUCTIVE METALLIZATION AND PIGMENT

Simplified Explanation

The invention is a method for mask exposure of a washable dye layer on a carrier substrate, followed by metallization in defined regions. The steps of the method include:

• Providing a carrier substrate.
• Applying a radiation-crosslinkable washable dye layer to the full area of the carrier substrate using print application.
• Exposing the washable dye layer in defined regions to radiation using a radiation mask, resulting in curing of the dye in those regions.
• Applying metallization over the full area of the substrate.
• Removing the non-radiation-exposed washable dye outside the defined regions, along with the metal present on it, using a solvent.
• The resulting carrier substrate has cured washable dye with metal applied only in the defined regions.

Potential applications of this technology:

• Fabrication of electronic circuits or devices with defined metallization patterns.
• Production of masks or stencils for various printing or etching processes.
• Creation of decorative or functional patterns on surfaces.

Problems solved by this technology:

• Precise and controlled application of washable dye and metallization in defined regions.
• Efficient removal of non-radiation-exposed dye and metal outside the defined regions.
• Simplified and cost-effective fabrication process for creating patterns or circuits.

Benefits of this technology:

• Enables the production of complex patterns or circuits with high precision.
• Reduces material waste by selectively applying dye and metal only where needed.
• Provides a versatile and scalable method for creating patterns on various substrates.

Original Abstract Submitted

the invention relates to a mask exposure method comprising the following steps:—the providing of a carrier substrate; the print application of a radiation-crosslinkable washable dye layer to the full area of the carrier substrate;—the exposure of the radiation-crosslinkable washable dye layer in defined regions to radiation by means of a radiation mask, such that the washable dye is cured in the defined regions;—the applying of a metallization over the full area;—the removing of the non-radiation-exposed washable dye outside the defined regions together with the metal present thereon with the aid of a solvent, such that the resultant carrier substrate has cured washable dye with metal applied thereto only in defined regions.