20240042539. Soldering Apparatus And Method Of Detecting Failures Of Gasket simplified abstract (SENJU METAL INDUSTRY CO., LTD.)
Contents
Soldering Apparatus And Method Of Detecting Failures Of Gasket
Organization Name
SENJU METAL INDUSTRY CO., LTD.
Inventor(s)
Soldering Apparatus And Method Of Detecting Failures Of Gasket - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240042539 titled 'Soldering Apparatus And Method Of Detecting Failures Of Gasket
Simplified Explanation
The patent application describes a soldering apparatus that includes a furnace body with a processing chamber for processing boards. The furnace body is equipped with a gasket that seals the furnace body. A sealed space is created by the furnace body and the gasket, which is isolated from the processing chamber. The apparatus also includes a gas supply apparatus that supplies a first gas into the sealed space, and a measuring apparatus that measures either the pressure in the sealed space or the concentration of a second gas in the sealed space.
- The soldering apparatus includes a furnace body with a processing chamber for processing boards.
- A gasket is provided on at least a part of the furnace body to seal it.
- The furnace body and the gasket define a sealed space that is isolated from the processing chamber.
- A gas supply apparatus is included to supply a first gas into the sealed space.
- A measuring apparatus is included to measure either the pressure in the sealed space or the concentration of a second gas in the sealed space.
Potential applications of this technology:
- Soldering and processing of boards in a controlled environment.
- Creation of a sealed space for specific gas treatments during soldering processes.
- Monitoring and control of gas pressure or gas concentration during soldering operations.
Problems solved by this technology:
- Ensures a controlled and sealed environment for soldering and processing boards.
- Allows for precise gas treatments during soldering processes.
- Provides accurate measurement and control of gas pressure or gas concentration.
Benefits of this technology:
- Improved soldering and processing quality due to the controlled environment.
- Enhanced reliability and consistency of soldering results.
- Increased efficiency and productivity in soldering operations.
- Enables the use of specific gas treatments for desired soldering outcomes.
Original Abstract Submitted
provided is a soldering apparatus including: a furnace body including a processing chamber in which boards are processed; a gasket provided at least to a part of the furnace body, and configured to seal the furnace body; a sealed space isolated from the processing chamber, and defined by the furnace body and the gasket; a gas supply apparatus configured to supply a first gas into the sealed space; and a measuring apparatus configured to measure one of pressure in the sealed space and concentration of a second gas in the sealed space.
